Patents by Inventor Harro Koning

Harro Koning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power routing with integrated decoupling capacitance
    Patent number: 8881087
    Abstract: An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network (200) which comprises, in a first one (metalz) of the conduction layers, a first mesh structure (210) of electrically conductive material for distribution of a first electrical potential (POWER) of the power supply. The power-supply distribution network also comprises, in a second one (metalz+1) of the conduction layers, different from the first one of the conduction layers, a second mesh structure (220) of electrically conductive material for distribution of a second electrical potential (GROUND) of the power supply.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: November 4, 2014
    Assignee: ST-Ericsson SA
    Inventors: Sjoerd Herder, Harro Koning
  • Power Routing with Integrated Decoupling Capacitance
    Publication number: 20130181337
    Abstract: An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network (200) which comprises, in a first one (metalz) of the conduction layers, a first mesh structure (210) of electrically conductive material for distribution of a first electrical potential (POWER) of the power supply. The power-supply distribution network also comprises, in a second one (metalz+1) of the conduction layers, different from the first one of the conduction layers, a second mesh structure (220) of electrically conductive material for distribution of a second electrical potential (GROUND) of the power supply.
    Type: Application
    Filed: September 28, 2011
    Publication date: July 18, 2013
    Applicant: ST-ERICSSON SA
    Inventors: Sjoerd Herder, Harro Koning