Patents by Inventor Harry A. Kunkel, III

Harry A. Kunkel, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5648942
    Abstract: A two phase composite acoustic backing for an ultrasonic transducer array is formed of a first composite material which is electrically conductive and relatively attenuative to acoustic energy and forms a plurality of isolated conductive paths between individual elements of the array and the back side of said backing. The isolated conductive paths are surrounded by an acoustic kerf filler material which is non-conductive and is either attenuative to acoustic energy, exhibits a low acoustic impedance, or both. The resulting two phase composite acoustic backing thus attenuates ultrasonic energy which enters the backing from the transducer elements, both in the conductive paths and in the surrounding kerf filler material, while affording points of electrical attachment to cable wires for the array which are removed from the piezoelectric material.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: July 15, 1997
    Assignee: Advanced Technology Laboratories, Inc.
    Inventor: Harry A. Kunkel, III