Patents by Inventor Harry J. Goldlen

Harry J. Goldlen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5531838
    Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: July 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Roy L. Arldt, Susan H. Downey, Harry J. Goldlen, Issa S. Mahmoud, Clement A. Okoro, James Spalik