Abstract: A method for determining an altitude with a corona generating device having a grid and a coronode and a power supply for supply power to the grid and coronode, including: setting the grid at a predefined voltage with the power supply; applying a charge output voltage and a charged output current to the coronode with the power supply; monitoring the charged output voltage and the charge output current to the coronode from the power supply until a predefined charge output voltage is reached; correlating charged output current to an altitude when the predefined charge output voltage is reached.

Abstract: A method for determining an humidity in a xerographic printing machine with a corona generating device having a grid, a coronode, and a power supply for supply power to said grid and coronode, comprising: measuring a first temperature in a xerographic printing machine; setting the grid at a predefined voltage with the power supply; applying a charge output voltage and a charge output current to the coronode with the power supply; monitoring the charge output voltage and the charge output current to the coronode from the power supply until a predefined charge output voltage is reached; changing the first temperature in a xerographic printing machine to a second temperature; repeating said setting, said applying, and said monitoring for a second temperature; correlating the charge output current when said predefined charge output voltage is reached at said first temperature to the charge output current when said predefined charge output voltage is reached at said second temperature to an humidity value.

Abstract: A tool for separating a common printed wiring board substrate into a plurality of substrates where, prior to separation, the plurality of substrates are connected by at least one circuit connector. The purpose of the tool is to apply pressure along a dividing line to break the common substrate into separate boards without crimping or breaking the connectors between the boards. In a preferred embodiment, the tool has a beveled edge for contacting the common substrate with mechanism for adjusting the location of notches in the beveled edge. The notches are for alignment with the location of the connectors between the boards.

Abstract: A tool for separating a common printed wiring board substrate into a plurality of substrates where, prior to separation, the plurality of substrates are connected by at least one circuit connector. The purpose of the tool is to apply pressure along a dividing line to break the common substrate into separate boards without crimping or breaking the connectors between the boards. In a preferred embodiment, the tool has a beveled edge for contacting the common substrate with mechanism for adjusting the location of notches in the beveled edge. The notches are for alignment with the location of the connectors between the boards.

Abstract: A tool for separating a common printed wiring board substrate into a plurality of substrates where, prior to separation, the plurality of substrates are connected by at least one circuit connector. The purpose of the tool is to apply pressure along a dividing line to break the common substrate into separate boards without crimping or breaking the connectors between the boards. In a preferred embodiment, the tool has a beveled edge for contacting the common substrate with mechanism for adjusting the location of notches in the beveled edge. The notches are for alignment with the location of the connectors between the boards.

Abstract: Printed wiring boards are often joined on a motherboard in order to optimize use of cabinet space. The process of the present invention enables more efficient manufacture and assembly of adjoining printed wiring boards. The steps of the inventive process comprise forming multiple circuits upon a common substrate before the common substrate is separated into separate boards; making interconnections between the separate boards, preferably in situ and before the boards are separated; and separating the common substrate into a plurality of separate interconnected boards. Using the inventive process, interconnections between boards can be fully tested on a single substrate and inventory and handling processes relating to joining of separate boards can be simplified or eliminated.