Patents by Inventor Harry Jay Levinson

Harry Jay Levinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming semiconductor device with multiple level patterning
    Patent number: 8815748
    Abstract: A method for forming a semiconductor device is provided including processing a wafer having a target material, forming a multilevel photoresist structure having a protection layer over the target material, and forming a multilevel recess in the target material with the multilevel photoresist structure.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: August 26, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Thomas Ingolf Wallow, Ryoung-han Kim, Jongwook Kye, Harry Jay Levinson
  • Method of forming semiconductor device
    Patent number: 8236592
    Abstract: A method for forming a semiconductor device is provided including processing a wafer having a target material; forming a first pattern over the target material; forming a protection layer over the first pattern; and forming a second pattern, over the target material and not over the protection layer, without an etching step between the forming the first pattern and the forming the second pattern.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: August 7, 2012
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Ryoung-han Kim, Thomas Ingolf Wallow, Harry Jay Levinson, Jongwook Kye, Alden R. Acheta
  • METHOD OF FORMING SEMICONDUCTOR DEVICE
    Publication number: 20080171446
    Abstract: A method for forming a semiconductor device is provided including processing a wafer having a target material; forming a first pattern over the target material; forming a protection layer over the first pattern; and forming a second pattern, over the target material and not over the protection layer, without an etching step between the forming the first pattern and the forming the second pattern.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: ADVANCED MICRO DEVICES, INC.
    Inventors: Ryoung-han Kim, Thomas Ingolf Wallow, Harry Jay Levinson, Jongwook Kye, Alden R. Acheta
  • METHOD OF FORMING SEMICONDUCTOR DEVICE WITH MULTIPLE LEVEL PATTERNING
    Publication number: 20080171447
    Abstract: A method for forming a semiconductor device is provided including processing a wafer having a target material, forming a multilevel photoresist structure having a protection layer over the target material, and forming a multilevel recess in the target material with the multilevel photoresist structure.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: ADVANCED MICRO DEVICES, INC.
    Inventors: Thomas Ingolf Wallow, Ryoung-han Kim, Jongwook Kye, Harry Jay Levinson