Patents by Inventor Harry Kam Cheng Hong
Harry Kam Cheng Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6963124Abstract: A panel assembly of packaged integrated circuit devices including a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.Type: GrantFiled: September 17, 2004Date of Patent: November 8, 2005Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6933174Abstract: A leadless leadframe semiconductor package having a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts. The contacts also have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.Type: GrantFiled: September 30, 2004Date of Patent: August 23, 2005Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6818970Abstract: A leadless leadframe semiconductor package includes a plurality of contacts, at least some of which have integrally formed stems that extend to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates the stems and the contacts to leave contact surfaces of the contacts exposed on the bottom surface of the package. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, which has a plurality of tie bars and a plurality of contacts. The contacts have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.Type: GrantFiled: August 11, 2003Date of Patent: November 16, 2004Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6808961Abstract: A panel assembly of packaged integrated circuit devices comprising a conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.Type: GrantFiled: April 14, 2003Date of Patent: October 26, 2004Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6677667Abstract: A leadless leadframe semiconductor package comprising a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. The molded cap leaves the contact surfaces of the contacts exposed on the bottom surface of the package, leaves a peripheral surface of the stems exposed on the peripheral surface of the package, and covers a bottom surface of each of the stems. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts.Type: GrantFiled: November 28, 2000Date of Patent: January 13, 2004Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6629880Abstract: A system comprising a rotary buffing device for removing the mold-flash from leadless leadframe substrate panels is described. The leadless leadframe substrate panels have bottom surfaces that contain electrical contact landing and die attach pad surfaces. Covering at least some of the surfaces of the electrical contact landings and the die attach pads are formations of mold-flash, which are thin layers of molding material. The rotary buffing device is rotated at a sufficiently high rate such that the formations of flash are brushed (or buffed) off the bottom surfaces as the rotary wheel is run along the substrate panels.Type: GrantFiled: December 14, 2000Date of Patent: October 7, 2003Assignee: National Semiconductor CorporationInventors: Aik Seng Kang, Ah Lek Hu, Harry Kam Cheng Hong
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Patent number: 6576989Abstract: A panel assembly of packaged integrated circuit devices including conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described.Type: GrantFiled: November 28, 2000Date of Patent: June 10, 2003Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding
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Patent number: 6448107Abstract: Leadframe based packages, such as leadless leadframe packages are described that include an orientation indicator that is integrally formed with the leadframe. In one aspect, the leadframe includes a die attach pad, a plurality of contact fingers, a tie bar extending from the die attach pad, and an indicator stem extending from the tie bar. An integrated circuit die is mounted on the die attach pad and electrically coupled bond to associated contact fingers. A protective cap encapsulates the connectors and covers at least a portion of the die and contact fingers while leaving at least a portion of a bottom surface area of the contact fingers exposed to form external electrical contacts for the package. The protective cap leaves an identifying end of the indicator stem exposed through the surface of the protective cap to facilitate identification of a particular contact or region of the package. The described leadless leadframes may be produced in panel form which facilitates panel based packaging.Type: GrantFiled: November 28, 2000Date of Patent: September 10, 2002Assignee: National Semiconductor CorporationInventors: Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime Bayan, Peter Howard Spalding