Abstract: Adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as a corrosion inhibitor. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr.

Abstract: Die attach adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, Tl, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr.

Abstract: Die attach adhesive compositions comprise a quinolinol or a quinolinol derivative as an adhesion promoter.

Abstract: A conductive resin composition containing a curable resin, such as an adhesive resin, and a conductive metal filler, has improved conductivity through the addition of a metal salt of a carboxylic acid to the composition.

Abstract: Noble metal (e.g., silver) powder and/or flake is at least partially coated with a silver salt lubricant, and is prepared by milling a noble metal powder (e.g., silver) in the presence of a silver salt of dicarboxylic acid lubricant.

Abstract: A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, and (ii) a second composition comprising a monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, in which the curing temperatures or curing temperature ranges are sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition.