Abstract: A stabilizing tray for shipping and displaying stacked containers has a plurality of indexing openings through its bottom wall for receiving the necks of subjacent containers so that the necks of containers in a lower tray extend into recessed bottoms of containers in an upper tray. The bottom wall of the tray around the openings rests on shoulders of subjacent containers, and indexing notches around the edges of the indexing openings engage with protrusions on the containers to uniformly orient the containers. In one embodiment interlocking tabs and openings in adjacent walls hold the tray in erected configuration, and in another embodiment flaps on the ends of some of the walls are adhered to adjacent walls to hold the tray in erected configuration. The tray front wall has a reduced height and the back wall has an increased height to obscure date codes on the containers.

Abstract: An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated circuit. The conductive line of the flexible circuit can be attached to the power lines, synchronization line, memory erase line, or any other line that will disable, erase or otherwise prevent access to the integrated circuit if the flexible circuit conductive line is broken. The integrated circuit can be mounted to a printed circuit board. The printed circuit board, integrated circuit and flexible circuit can all be enclosed within the package.

Abstract: A package housing multiple semiconductor die includes a leadframe having a paddle and a number of lead fingers. A flexible circuit is adhesively laminated to both sides of the paddle. A first semiconductor die is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die is back-mounted to the top surface of the paddle and to the flexible circuit. The dies are encapsulated in a security coating and encased in plastic.

Abstract: An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated circuit. The conductive line of the flexible circuit can be attached to the power lines, synchronization line, memory erase line, or any other line that will disable, erase or otherwise prevent access to the integrated circuit if the flexible circuit conductive line is broken. The integrated circuit can be mounted to a printed circuit board. The printed circuit board, integrated circuit and flexible circuit can all be enclosed within the package.

Abstract: A package housing multiple semiconductor die includes a leadframe having a paddle and a number of lead fingers. A flexible circuit is adhesively laminated to both sides of the paddle. A first semiconductor die is back-mounted to the bottom surface of the paddle and wire-bonded to the flexible circuit and the lead fingers. A second semiconductor die is back-mounted to the top surface of the paddle and to the flexible circuit. The dies are encapsulated in a security coating and encased in plastic.

Abstract: This invention relates to immersion ultrasonic pulse-echo testing of tubes or bars for internal defects wherein means are provided to continuously monitor the operation of the test channel. As ultrasonic energy enters the workpiece, the round workpiece surface causes acoustic energy scatter responsive echo signals which are sensed by the transmitter probe, are amplified and applied to a threshold circuit. If the amplitude of the scatter responsive signal falls below a predetermined level, an output signal indicative of "loss of operation" is produced. Means are provided to inhibit such output signal in the event of only a momentary decrease of the scatter responsive signal below a predetermined value.