Abstract: A polishing method and apparatus is set forth utilizing an elongate stepped base assembly comprising a planar lower surface spaced below a a parallel upper surface. The upper surface includes a FIG. 8 recess therein defined by two overlapping cylindrical recesses. Each of the cylindrical recesses are of a predetermined diameter to receive a polishing rod defined by a diameter less than that of said predetermined diameter to be slidably received within each of said recesses. The polishing rod has secured thereto a first adhesive band adherably mounting a second adhesive strap onto a lowermost end surface of the polishing rod. A workpiece is adherably mounted to the second adhesive strap and directed interiorly of one of said cylindrical recesses subsequent to positioning a fabric polishing sheet containing polishing compound within the one cylindrical recess.