Abstract: The present invention provides a method of forming a polishing pad for chemical mechanical planarization utilizing laser ablation. In particular, the method includes providing a laser to cut a groove into the polishing pad and providing a beam splitter to split a laser beam from the laser. Further, the method provides splitting the beam from the laser to provide multiple laser beams onto the polishing pad and wherein the multiple laser beams have effective cutting areas that at least overlap each other.

Abstract: The polishing pad is useful for polishing a surface of an electronic substrate. The pad comprises a polymeric matrix and polymeric microelements within the polymeric matrix. The polymeric microelements have a mean diameter of less than 150 ?m (0.0059?). The pad has grooves forming artifacts and a depth less than 2000 times the mean diameter of the polymeric microelements; and the artifacts are spaced apart 0.1 to 10 mm (0.0039? to 0.39?) and have a width of 1 to 5 mm (0.039? to 0.20?).