Abstract: A one time programmable nonvolatile memory formed from metal-insulator-semiconductor cells. The cells are at the crosspoints of conductive gate lines and intersecting doped semiconductor lines formed in a semiconductor substrate.

Abstract: A method and system for enabling auto shut-off of programming of a non-volatile memory cell is disclosed. The system includes a memory array having a plurality of memory cells, each cell storing one bit of data. During the programming process, programming signals are applied to the target memory cells. A predefined period of time after the programming signals are applied, the auto shut-off system begins sensing an output signal from the memory cell. After the system detects an output signal from the memory cell, the system waits for a second predefined period of time before turning off the programming voltages. The system may be configured to sense an output voltage from the memory cell. The system then compares the output voltage to a reference voltage in order to detect when the cell is programmed. Alternatively, the system may sense an output current from the memory cell. The system then compares the output current to a reference current to detect when the cell is programmed.

Abstract: A one time programmable nonvolatile memory formed from metal-insulator-semiconductor cells. The cells are at the crosspoints of conductive gate lines and intersecting doped semiconductor lines formed in a semiconductor substrate.

Abstract: A method and system for enabling auto shut-off of programming of a non-volatile memory cell is disclosed. The system includes a memory array having a plurality of memory cells, each cell storing one bit of data. During the programming process, programming signals are applied to the target memory cells. A predefined period of time after the programming signals are applied, the auto shut-off system begins sensing an output signal from the memory cell. After the system detects an output signal from the memory cell, the system waits for a second predefined period of time before turning off the programming voltages. The system may be configured to sense an output voltage from the memory cell. The system then compares the output voltage to a reference voltage in order to detect when the cell is programmed. Alternatively, the system may sense an output current from the memory cell. The system then compares the output current to a reference current to detect when the cell is programmed.

Abstract: A semiconductor memory structure based on gate oxide break down is constructed in a deep N-well. Thus, the electrical field over the programmable element during the transient procedure of gate oxide break down can be controlled to achieve the best memory programming results. The conductivity of the programmed memory cell is increased greatly and conductivity variation between the memory cells is reduced. This is achieved by adding a body bias during the programming process. The body here refers to a P-well formed within the deep N-Well. Furthermore, the read voltage offset is reduced greatly with this new memory configuration. These improved programming results will allow faster read speed and lower read voltage. This new structure also reduces current leakage from a memory array during programming.

Abstract: An electrically programmable, non-volatile resistive memory includes an array of memory cells, a plurality of bit lines, and a plurality of word lines. Each memory cell comprises a resistive element and a Schottky diode coupled in series and having first and second terminals. Each bit line couples to the first terminal of all memory cells in a respective column of the array. Each word line couples to the second terminal of all memory cells in a respective row of the array. The resistive element for each memory cell may be formed with a film of a perovskite material (e.g., Pr0.7Ca0.3MnO3). The Schottky diode for each memory cell may be formed by a thin film of amorphous silicon. The films for the resistive element and Schottky diode for each memory cell may be stacked in a compact island at the cross point between a bit line and a word line.

Abstract: A semiconductor memory structure based on gate oxide break down is constructed in a deep N-well. Thus, the electrical field over the programmable element during the transient procedure of gate oxide break down can be controlled to achieve the best memory programming results. The conductivity of the programmed memory cell is increased greatly and conductivity variation between the memory cells is reduced. This is achieved by adding a body bias during the programming process. The body here refers to a P-well formed within the deep N-Well. Furthermore, the read voltage offset is reduced greatly with this new memory configuration. These improved programming results will allow faster read speed and lower read voltage. This new structure also reduces current leakage from a memory array during programming.