Patents by Inventor Harry T. Johnson

Harry T. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6624093
    Abstract: A high dielectric insulator for integrated circuit use is produced by depositing hafnium on a silicon dioxide surface of a silicon wafer and then promoting a solid-state reaction between the silicon dioxide and the hafnium by heating the wafer to produce hafnium silicate.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: September 23, 2003
    Assignee: WiSys Technology Foundation
    Inventors: Paul F. Lyman, Harry T. Johnson-Steigelman
  • Patent number: 4431389
    Abstract: A fluid pressure energy translating device of the sliding vane type comprising a cam ring including an internal contour, a rotor having a plurality of vanes rotatable therewith and slidable relative thereto in slots in the rotor with one end of each vane engaging the internal contour. The rotor and internal contour cooperate to define one or more pumping chambers between the periphery of the rotor and the cam contour through which the vanes pass carrying fluid from an inlet port to an outlet port. At least one cheek plate is associated with the body and rotor. Two pressure chambers are formed for each vane and each vane has two surfaces, one in each chamber, both being effective under pressure in the respective chambers to urge the vanes into engagement with the cam. A generally annular internal feed passage is formed entirely within the rotor and communicates with one set of the pressure chambers.
    Type: Grant
    Filed: June 22, 1981
    Date of Patent: February 14, 1984
    Assignee: Vickers, Incorporated
    Inventor: Harry T. Johnson
  • Patent number: 4397171
    Abstract: A sheet metal blank is placed at the entrance of a die having a splined interior contour. A punch having a conjugate splined surface enters and passes longitudinally through the die. The splines are formed by passing the blank and punch through the die within an annular space whose contour defines the final spline configuration. Alternatively, preformed splines having a large pressure angle and full corner radii are reformed by multiple passes through dies whose configurations vary to produce shallow pressure angle splines and tight corner radii.
    Type: Grant
    Filed: July 27, 1981
    Date of Patent: August 9, 1983
    Assignee: Ford Motor Company
    Inventors: Sang-Kee Suh, Gotz S. Hauser, Harry T. Johnson