Abstract: Disclosed is a method for fabricating semiconductor devices and apparatus that can be used in the practice thereof. A plurality of sets of lead wires is mounted on a reusable primary lead frame. While the lead frame, and thus the lead wires are supported, a pellet is attached to one wire of each of the sets and appropriate flying leads are bonded in place. The sets of lead wires are then transferred to a reusable segmented lead frame, that includes a plurality of elements which are resiliently mounted with respect to each other. Each element supports one set of lead wires. A plurality of cup-shaped mold cavities defined by the mold are filled with a curable fluid encapsulant. The mold is adapted to cooperate with the segmented lead frame as hereinafter set forth. The ends of the lead wires supporting the pellets are immersed in the encapsulant.

Abstract: Disclosed is a method for fabricating semiconductor devices and apparatus that can be used in the practice thereof. A plurality of sets of lead wires is mounted in a reusable primary lead frame. While supporting the lead frame, and thus the lead wires, a pellet is attached to one wire of each of the sets and appropriate flying leads are bonded in place. The sets of lead wires are then transferred to a reusable segmented lead frame, that includes a plurality of elements which are resiliently mounted with respect to each other. Each element supports one set of lead wires. A plurality of cup-shaped mold cavities defined by the mold are filled with a curable fluid encapsulant. The mold is adapted to cooperate with the segmented lead frame as hereinafter set forth. The ends of the lead wires supporting the pellets are immersed in the encapsulant.