Abstract: Object tracking using sensors that harvest energy from radio frequency (RF) signals described. The sensor may harvest energy from signals absorbed by a metalized layer of a sensor. The energy may energize a microcontroller and facilitate the broadcast of another RF signal. Additionally, the capture and communication of broadcasted RF signals is described.

Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.

Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.

Abstract: A chip package structure is disclosed. In one example, the chip package may include a chip, an encapsulation material, and an exposed pad that is electrically conductively connected to the chip. A layer of a porous or dendrite-comprising adhesion promoter is on a surface of the exposed pad. A thermal interface material that is attached to the exposed pad by the layer.

Abstract: A method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a deposition process at a temperature below the melting temperature of the auxiliary carrier, keeping a gap between the passivation layers at the side surfaces of adjacent dies of the plurality of dies.

Abstract: A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.

Abstract: A guarded power saw assembly (10) that ensures that a blade (58) is always positioned out of reach of the operator is disclosed.

Abstract: An integral guide mechanism (2) for a power drill (1) which has retractable arms (10, 11) cooperating with the housing of said power drill. A workpiece engaging base (14) is on the retractable arms. The retractable arms enable retraction of the base towards the housing of the power drill past the chuck (6) and a catch arrangement holds them retracted. The base of the guide mechanism has a seat (20) to enable the base to be stably positioned against a pipe or other non-planar surface. The seat can include V blocks (24) to be positioned on the side of the base opposite to which the drill bit approaches or be positioned on the same side from which the drill bit approaches to cradle an article to be drilled.

Abstract: A plurality of individual openings provided in a sheet strip material by a stamping device are passed in succession through a monitoring station positioned adjacent the outlet of the stamping device. As each individual opening is passed through the monitoring station, the monitoring station produces a plurality of voltage signals which identify the progres of each opening through the monitoring station and the progres of the sheet strip material through the stamping device. A controller is provided having an input for receiving the plurality of voltage signals produced as each opening is passed through the monitoring station and an output connected to the stamping device. Within the controller, the plurality of voltage signals identifying the progress of an individual opening through the monitoring station are compared to the plurality of voltage signals identifying the progress of a following opening through the monitoring station.

Abstract: A plurality of individual openings provided in a sheet strip material by a stamping device are passed in succession through a monitoring station positioned adjacent the outlet of the stamping device. As each individual opening is passed through the monitoring station, the monitoring station produces a plurality of voltage signals which identify the progress of each opening through the monitoring station and the progress of the sheet strip material through the stamping device. A controller is provided having an input for receiving the plurality of voltage signals produced as each opening is passed through the monitoring station and an output connected to the stamping device. Within the controller, the plurality of voltage signals identifying the progress of an individual opening through the monitoring station are compared to the plurality of voltage signals identifying the progress of a following opening through the monitoring station.

Abstract: Biuret polyisocyanate is prepared by reacting a hindered polyamine and a polyisocyanate at elevated temperatures, in the presence of an excess of polyisocyanate. The resulting product may be utilized to prepare an outstanding foam composition.