Abstract: A flexible circuit and a method of fabricating the flexible circuit is provided wherein adhesive is flowed into the interstices of a fabric. The adhesive is then cured to a “B” stage and a conductive foil is bonded to the adhesive on one or both sides of the fabric. Thereafter, the adhesive may be fully cured. A conductive pattern may then be etched into the conductive foil via print and etch techniques. The conductive pattern may be protected with a cover layer. For example, the cover layer may be a base layer with adhesive flowed in its pores and fully cured. The adhesive may be effectively formulated to withstand stresses between the adhesive and the conductive pattern such that bending and flexing the flexible circuit or subjecting the flexible circuit to thermal stresses does not delaminate the bond between the adhesive and the conductive pattern. The adhesive resists delamination from the fabric because the adhesive has been flowed into the fabric's interstices and cured.