Abstract: An example method includes forming a cavity in a multi-layer substrate of a leadframe. The cavity extends from a first substrate surface of the leadframe into the multi-layer substrate to define a cavity floor spaced from the first substrate surface by a cavity sidewall, and at least one conductive terminal is on the cavity floor. The method also includes placing an inductor module in the cavity, in which the inductor module includes a conductor embedded within a dielectric substrate between spaced apart first and second inductor terminals of the inductor module. The method also includes coupling at least one of the first and second inductor terminals to the at least one conductive terminal on the cavity floor. The method also includes encapsulating the inductor module and at least a portion of the leadframe with a mold compound.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may perform, while camped on a cell of a first radio access technology (RAT), a search for closed access group (CAG) cells of a second RAT different from the first RAT. The UE may populate a database based at least in part on the search, wherein populating the database includes associating the cell of the first RAT with one or more of the CAG cells of the second RAT. The UE may perform a reselection process from the cell of the first RAT to a first CAG cell of the second RAT, of the one or more CAG cells of the second RAT. Numerous other aspects are described.

Abstract: An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate has first, second, and third levels including respective dielectric layers and conductive features, the first level including a first trace layer with an antenna and a first via layer with a portion of a ground wall laterally spaced outward from and surrounding the antenna, and the second level including a second trace layer having a ground plane connected to the ground wall, the semiconductor die attached to the first level of the multilevel package substrate, and the package structure including a molding compound enclosing the semiconductor die and extending on a side of the antenna, where the package structure mold compound maters and thickness can be tuned for improved performance.

Abstract: An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.

Abstract: In examples, a semiconductor package comprises a conductive terminal; a semiconductor die including a device side having circuitry formed therein, the device side facing toward the conductive terminal; and a substrate coupled to the conductive terminal and to the device side of the semiconductor die. The substrate includes a first metal layer coupled to first and second vias extending toward and coupled to either the device side of the semiconductor die or the conductive terminal. The substrate includes a second metal layer electrically isolated from the first metal layer by an insulation layer between the first and second metal layers, the second metal layer coupled to a third via extending toward and coupled to either the conductive terminal or the semiconductor die. The first and second metal layers form a Marchand balun.

Abstract: An example device includes: a multilayer build-up package substrate including trace conductor layers spaced from one another by dielectric material, and further including connection conductor layers coupling portions of the trace conductor layers through dielectric material, the multilayer build-up package substrate having a device side surface with one of the trace conductor layers and an opposing board side surface with one of the connection conductor layers; and a waveguide transition formed from the multilayer build-up package substrate, the waveguide transition having an input port formed from the connection conductor layer on the board side surface, and having at least two sub-transitions spaced laterally from one another, the at least two sub-transitions to couple a signal from the input port through the trace conductor layers and the connection conductor layers to a coplanar waveguide formed from the trace conductor layer on the device side surface.

Abstract: In examples, a semiconductor package comprises a semiconductor substrate including a device side having circuitry formed therein. The package also includes a conductive layer positioned above the semiconductor substrate; a patch antenna coupled to the conductive layer and to the device side of the semiconductor substrate; and a mold compound covering the patch antenna. The mold compound has a relative permittivity ranging from 3.4 to 3.5 and a loss tangent ranging from 0.0025 to 0.013.

Abstract: An example microelectronic device package includes: a multilayer package substrate including a slotted waveguide antenna and having routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to slotted waveguide antenna by the routing conductors; and mold compound covering the semiconductor die, and a portion of the multilayer package substrate.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In various embodiments, a wireless device processor may determine a threat score for a first cell, determine whether the first cell threat score is below a first threat score threshold, update a good neighbor cell data structure using neighbor cell information from the first cell in response to determining that the first cell threat score is below the first threat score threshold, performing cell reselection to a second cell, determine whether the second cell transmits a system information block message indicating fake neighbor cell information, and increase a threat score for the second cell in response to determining that the second cell provides the SIB message indicating fake neighbor cell information and that a good neighbor cell data structure includes an indication of one or more good neighbor cells that are within the time threshold and the location threshold and doing countermeasures in a response to the determination.

Abstract: A method and system including a display; at least one application programming interface (API) including one or more parameters, wherein the API communicates with a code of a system under test; a code testing module including a multiple variant generation and handling module; and a code testing processor in communication with the code testing module and operative to execute processor-executable process steps to cause the system to: receive data identifying the API; display one or more parameters associated with the API; generate, with the multiple variant generation and handling module, one or more variants based on values associated with the one or more parameters; receive the one or more generated variants at a variant injector; inject the one or more generated variants into the code via the API; and execute the code with the one or more injected generated variants. Numerous other aspects are provided.

Abstract: A method and system including a display; at least one application programming interface (API) including one or more parameters, wherein the API communicates with a code of a system under test; a code testing module including a multiple variant generation and handling module; and a code testing processor in communication with the code testing module and operative to execute processor-executable process steps to cause the system to: receive data identifying the API; display one or more parameters associated with the API; generate, with the multiple variant generation and handling module, one or more variants based on values associated with the one or more parameters; receive the one or more generated variants at a variant injector; inject the one or more generated variants into the code via the API; and execute the code with the one or more injected generated variants. Numerous other aspects are provided.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.