Abstract: In examples, a semiconductor package comprises a conductive terminal; a semiconductor die including a device side having circuitry formed therein, the device side facing toward the conductive terminal; and a substrate coupled to the conductive terminal and to the device side of the semiconductor die. The substrate includes a first metal layer coupled to first and second vias extending toward and coupled to either the device side of the semiconductor die or the conductive terminal. The substrate includes a second metal layer electrically isolated from the first metal layer by an insulation layer between the first and second metal layers, the second metal layer coupled to a third via extending toward and coupled to either the conductive terminal or the semiconductor die. The first and second metal layers form a Marchand balun.

Abstract: An example device includes: a multilayer build-up package substrate including trace conductor layers spaced from one another by dielectric material, and further including connection conductor layers coupling portions of the trace conductor layers through dielectric material, the multilayer build-up package substrate having a device side surface with one of the trace conductor layers and an opposing board side surface with one of the connection conductor layers; and a waveguide transition formed from the multilayer build-up package substrate, the waveguide transition having an input port formed from the connection conductor layer on the board side surface, and having at least two sub-transitions spaced laterally from one another, the at least two sub-transitions to couple a signal from the input port through the trace conductor layers and the connection conductor layers to a coplanar waveguide formed from the trace conductor layer on the device side surface.

Abstract: In examples, a semiconductor package comprises a semiconductor substrate including a device side having circuitry formed therein. The package also includes a conductive layer positioned above the semiconductor substrate; a patch antenna coupled to the conductive layer and to the device side of the semiconductor substrate; and a mold compound covering the patch antenna. The mold compound has a relative permittivity ranging from 3.4 to 3.5 and a loss tangent ranging from 0.0025 to 0.013.

Abstract: An example microelectronic device package includes: a multilayer package substrate including a slotted waveguide antenna and having routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to slotted waveguide antenna by the routing conductors; and mold compound covering the semiconductor die, and a portion of the multilayer package substrate.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In various embodiments, a wireless device processor may determine a threat score for a first cell, determine whether the first cell threat score is below a first threat score threshold, update a good neighbor cell data structure using neighbor cell information from the first cell in response to determining that the first cell threat score is below the first threat score threshold, performing cell reselection to a second cell, determine whether the second cell transmits a system information block message indicating fake neighbor cell information, and increase a threat score for the second cell in response to determining that the second cell provides the SIB message indicating fake neighbor cell information and that a good neighbor cell data structure includes an indication of one or more good neighbor cells that are within the time threshold and the location threshold and doing countermeasures in a response to the determination.

Abstract: A method and system including a display; at least one application programming interface (API) including one or more parameters, wherein the API communicates with a code of a system under test; a code testing module including a multiple variant generation and handling module; and a code testing processor in communication with the code testing module and operative to execute processor-executable process steps to cause the system to: receive data identifying the API; display one or more parameters associated with the API; generate, with the multiple variant generation and handling module, one or more variants based on values associated with the one or more parameters; receive the one or more generated variants at a variant injector; inject the one or more generated variants into the code via the API; and execute the code with the one or more injected generated variants. Numerous other aspects are provided.

Abstract: A method and system including a display; at least one application programming interface (API) including one or more parameters, wherein the API communicates with a code of a system under test; a code testing module including a multiple variant generation and handling module; and a code testing processor in communication with the code testing module and operative to execute processor-executable process steps to cause the system to: receive data identifying the API; display one or more parameters associated with the API; generate, with the multiple variant generation and handling module, one or more variants based on values associated with the one or more parameters; receive the one or more generated variants at a variant injector; inject the one or more generated variants into the code via the API; and execute the code with the one or more injected generated variants. Numerous other aspects are provided.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.

Abstract: In one general embodiment, a computer-implemented method includes identifying a data dump and a predefined data structure, parsing the predefined data structure to determine one or more identifiers within the predefined data structure, determining that a match exists between one or more elements of the data dump and the one or more determined identifiers of the predefined data structure, and formatting the data dump utilizing the predefined data structure, in response to the determining.