Abstract: A conveyor and fixing unit are provided for fitting in a printing machine, which can be used to apply solder paste to a substrate, for example, a printed circuit board, at predetermined points. The substrate may also be a ceramic object, a flexible tape, a wafer, or other body suitable for the material to be applied. The material may also be an adhesive, silicone or epoxy resin. In order to execute a printing process for the application of solder paste, the substrate to be printed is conveyed by the conveyor unit from a substrate stack to the printing machine, where the substrate is aligned relative to a mask there provided, and solder paste is then applied to the areas of the printed circuit board to be printed by means of a doctor blade.

Abstract: A device is proposed for the conveyance and releasable fixing of substrates (27) to be printed in a printing process, with a conveyor device (2, 4) which conveys the substrate (27) to a fixing device (3) which fixes the substrate (27) by means of contact with side edge areas (33) of the substrate (27) lying in the direction of conveyance (F), wherein the fixing device (3) has support means (21) on which the substrate (27) lies in the side edge area.