Abstract: A method for identifying cracks in non-planar substrates is herein disclosed. Images of a substrate in a relaxed state are captured and assessed to identify cracks, if any. Assessment may be conducted optically using broad band illumination, laser illumination, or infrared illumination. Mechanisms for carrying out the method are also disclosed.

Abstract: There is disclosed a method for automatically checking position data of J-leads at a semiconductor component enclosed in a housing with respect to a plane parallel to the bottom side of the housing. The bottom side of the housing is illuminated by light from an illuminator at at least one reproducible angle. The light reflected from the bottom side of the housing and the leads at essentially right angles is picked up by a camera with high resolution. The image signals of the camera are fed to an image signal processing device, and at least one data record with an indicator assigned to the semiconductor component is stored. From the image signals, position data of the leads are determined. Any deviation of the position data from predetermined nominal values is determined by comparing the position data with reference data.