Abstract: In a semiconductor laser, at least one temperature sensor is disposed directly on or integrated in a semiconductor laser chip for measuring an operating temperature. Precisely and/or locally solved measurement of the operating temperature of the laser are possible. One or more temperature sensors may be placed and fastened directly onto the laser chip or in a hole of the laser chip by welding, especially with Nd-YAG-laser light or light with similar characteristics. Fine equalization of temperature may be carried out, for example, by Peltier elements, components of the Peltier elements being mounted directly onto the laser chip. A cascaded arrangement of thermoelements and Peltier elements on a laser chip is also provided for.

Abstract: A process for creating an optical and electric connection of electro-optical components that can be implemented inexpensively and has long-term stability and thermal stability, so that information-transmitting light from one or more waveguides of one component can be coupled into one or more waveguides of the other component in an economically feasible manner. An optical and/or electro-optical connection of two optical and/or electro-optical components is created by mounting the two components directly on a single common carrier board by welding with electromagnetic radiation in the wavelength range around 1 &mgr;m without using any auxiliary carriers.

Abstract: An optical and/or electro-optical connection of two optical and/or electro-optical components comprises structures with optical waveguides arranged parallel or essentially parallel to the contact face on a carrier board in the area of the connection. The two components are mounted directly on a single common carrier board by welding with electromagnetic radiation in the wavelength range around 1 &mgr;m without using any auxiliary carriers.