Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.

Abstract: Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R1, R2, R3, R4 and R5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R1, R2, R3, R4 and R5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R11 and R14 independently represents a hydrogen atom or a hydroxy group; and each of R12 and R13 independently represents a hydrogen atom or an alkyl group.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R1, R2, R3, R4 and R5 independently represents a hydroxy group, a hydrogen atom or an alkyl group; at least two of R1, R2, R3, R4 and R5 are hydroxy groups; each Ar independently represents at least one group selected from the group consisting of the following Formulae (IIIa) and (IIIb); each of R11 and R14 independently represents a hydrogen atom or a hydroxy group; and each of R12 and R13 independently represents a hydrogen atom or an alkyl group.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.