Patents by Inventor Haruhiko Aoi

Haruhiko Aoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible base materials for printed circuits
    Patent number: 4937133
    Abstract: Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.
    Type: Grant
    Filed: March 27, 1989
    Date of Patent: June 26, 1990
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Hisashi Watanabe, Seiji Satou, Akira Tokumitsu, Kazuya Miyamoto, Haruhiko Aoi