Patents by Inventor Haruhiko Doi
Haruhiko Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230364174Abstract: In an aspect, the present disclosure provides a method for producing an extract composition by which polyphenols such as apigenin and/or essential oil components such as spiro-ether can be efficiently extracted from harvested herbaceous plants. An aspect of the present disclosure is directed to a method for producing an extract composition, including processes (1) and (2) below: (1) applying an oxidative stress to a harvested herbaceous plant and preserving it; and (2) obtaining an extract from the herbaceous plant that has undergone the process (1).Type: ApplicationFiled: September 30, 2021Publication date: November 16, 2023Applicant: Kao CorporationInventors: Haruhiko DOI, Daisuke KAYAKUBO, Yuka YAMAZAWA
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Patent number: 11814547Abstract: Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of 0.45 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).Type: GrantFiled: September 18, 2019Date of Patent: November 14, 2023Assignee: KAO CORPORATIONInventors: Haruhiko Doi, Norihito Yamaguchi, Masato Sugahara, Takanao Seike, Masaki Inoue
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Publication number: 20220002588Abstract: Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of (145 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).Type: ApplicationFiled: September 18, 2019Publication date: January 6, 2022Applicant: KAO CORPORATIONInventors: Haruhiko DOI, Norihito YAMAGUCHI, Masato SUGAHARA, Takanao SEIKE, Masaki INOUE
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Patent number: 10703935Abstract: Provided is a polishing composition for a silicon oxide film that can improve the speed of polishing a silicon oxide film. In one or more embodiments, a polishing composition for a silicon oxide film contains: water; a cerium oxide particle; and a compound having in its molecule an amino group and at least one acid group selected from a sulfonic acid group and a phosphonic acid group. In the polishing composition, [the number of moles of the acid group contained in the compound]/[total surface area of the cerium oxide particle] is in a range from 1.6×10?5 mol/m2 to 5.0×10?2 mol/m2.Type: GrantFiled: September 25, 2015Date of Patent: July 7, 2020Assignee: KAO CORPORATIONInventors: Haruhiko Doi, Koji Kinuta
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Publication number: 20200024481Abstract: Provided is a polishing composition capable of improving polishing selectivity and reducing polishing unevenness while increasing polishing rate. The present disclosure relates to a polishing composition containing: cerium oxide particles A; an oligosaccharide B; and water. The oligosaccharide B contains a saccharide made up of 3 to 5 glucoses linked together. In the oligosaccharide B, a content of a saccharide made up of 8 or more glucoses linked together is 27 mass % or less.Type: ApplicationFiled: September 28, 2017Publication date: January 23, 2020Applicant: Kao CorporationInventors: Haruhiko DOI, Tsubasa OYAMA
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Publication number: 20190241766Abstract: Provided is a polishing composition capable of improving polishing selectivity and reducing polishing unevenness while increasing polishing rate. The present disclosure relates to a polishing composition containing; cerium oxide particles A; a polysaccharide B having a weight average molecular weight of 800 or more and 2800 or less; and water.Type: ApplicationFiled: September 28, 2017Publication date: August 8, 2019Applicant: KAO CORPORATIONInventor: Haruhiko DOI
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Publication number: 20170292038Abstract: Provided is a polishing composition for a silicon oxide film that can improve the speed of polishing a silicon oxide film. In one or more embodiments, a polishing composition for a silicon oxide film contains: water; a cerium oxide particle; and a compound having in its molecule an amino group and at least one acid group selected from a sulfonic acid group and a phosphonic acid group. In the polishing composition, [the number of moles of the acid group contained in the compound]/[total surface area of the cerium oxide particle] is in a range from 1.6×10?5 mol/m2 to 5.0×10?2 mol/m2.Type: ApplicationFiled: September 25, 2015Publication date: October 12, 2017Applicant: Kao CorporationInventors: Haruhiko DOI, Koji KINUTA
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Patent number: 9070399Abstract: There is provided a polishing composition for a magnetic disk substrate that can reduce scratches, nanoprotrusion defects, and substrate surface waviness after polishing. The polishing composition for a magnetic disk substrate that contains: a copolymer that has a constituent unit derived from a monomer having a solubility of 2 g or less in 100 g of water at 20° C. and a constituent unit having a sulfonic acid group, and has a saturated hydrocarbon chain as the main chain thereof, or a salt of the copolymer; an abrasive; and water.Type: GrantFiled: December 18, 2009Date of Patent: June 30, 2015Assignee: Kao CorporationInventors: Takeshi Hamaguchi, Haruhiko Doi
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Patent number: 9053736Abstract: A method for manufacturing an aluminosilicate glass substrate for a hard disk of the present invention includes polishing an aluminosilicate glass substrate to be polished with a polishing composition that includes silica particles, a polymer having a sulfonic acid group, and water, wherein an adsorption constant of the polymer having the sulfonic acid group on aluminosilicate glass is 1.5 to 5.0 L/g. The polymer having the sulfonic acid group is preferably a polymer having an aromatic ring. The weight average molecular weight of the polymer having the sulfonic acid group is 3000 to 100000.Type: GrantFiled: April 19, 2011Date of Patent: June 9, 2015Assignee: Kao CorporationInventors: Haruhiko Doi, Yosuke Uchino, Kazuhiko Nishimoto
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Publication number: 20140346138Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.Type: ApplicationFiled: August 12, 2014Publication date: November 27, 2014Inventors: Yoshiaki OSHIMA, Norihito YAMAGUCHI, Haruhiko DOI
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Publication number: 20140335763Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ?CV value of 0 to 10% and water.Type: ApplicationFiled: July 29, 2014Publication date: November 13, 2014Inventors: Yoshiaki OSHIMA, Takeshi HAMAGUCHI, Kanji SATO, Norihito YAMAGUCHI, Haruhiko DOI
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Patent number: 8834589Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.Type: GrantFiled: April 26, 2007Date of Patent: September 16, 2014Assignee: Kao CorporationInventors: Yoshiaki Oshima, Norihito Yamaguchi, Haruhiko Doi
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Publication number: 20130220973Abstract: Provided is a method for producing a glass hard disk substrate, including steps of polishing a glass substrate with an acidic polishing liquid; and subjecting the obtained substrate to alkali cleaning. This method can inhibit degradation of surface roughness of the glass substrate in the alkali cleaning step while maintaining a polishing rate in the polishing step, and further can improve cleanliness. The method for producing a glass hard disk substrate includes the following steps (1) and (2): (1) polishing a glass substrate to be polished using a polishing composition of pH 1.0-4.2 that contains a polyvalent amine compound having 2 to 10 nitrogen atoms in the molecule; and (2) cleaning the substrate obtained in the step (1) using a cleaner composition of pH 8.0-13.0.Type: ApplicationFiled: October 26, 2011Publication date: August 29, 2013Applicant: KAO CORPORATIONInventors: Haruhiko Doi, Nobuyuki Aono
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Publication number: 20130032571Abstract: A method for manufacturing an aluminosilicate glass substrate for a hard disk of the present invention includes polishing an aluminosilicate glass substrate to be polished with a polishing composition that includes silica particles, a polymer having a sulfonic acid group, and water, wherein an adsorption constant of the polymer having the sulfonic acid group on aluminosilicate glass is 1.5 to 5.0 L/g. The polymer having the sulfonic acid group is preferably a polymer having an aromatic ring. The weight average molecular weight of the polymer having the sulfonic acid group is 3000 to 100000.Type: ApplicationFiled: April 19, 2011Publication date: February 7, 2013Applicant: KAO CORPORATIONInventors: Haruhiko Doi, Yosuke Uchino, Kazuhiko Nishimoto
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Publication number: 20110240594Abstract: There is provided a polishing composition for a magnetic disk substrate that can reduce scratches, nanoprotrusion defects, and substrate surface waviness after polishing. The polishing composition for a magnetic disk substrate that contains: a copolymer that has a constituent unit derived from a monomer having a solubility of 2 g or less in 100 g of water at 20° C. and a constituent unit having a sulfonic acid group, and has a saturated hydrocarbon chain as the main chain thereof, or a salt of the copolymer; an abrasive; and water.Type: ApplicationFiled: December 18, 2009Publication date: October 6, 2011Inventors: Takeshi Hamaguchi, Haruhiko Doi
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Publication number: 20110203186Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ? CV value of 0 to 10% and water.Type: ApplicationFiled: November 4, 2009Publication date: August 25, 2011Inventors: Yoshiaki Oshima, Takeshi Hamaguchi, Kanji Sato, Norihito Yamaguchi, Haruhiko Doi
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Publication number: 20070254563Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.Type: ApplicationFiled: April 26, 2007Publication date: November 1, 2007Inventors: Yoshiaki Oshima, Norihito Yamaguchi, Haruhiko Doi