Abstract: A silicone resin-linear co-polymer is disclosed. The silicone resin-linear copolymer includes a resinous structure having the general formula (1): (R1R2R3SiO1/2)x(R4SiO3/2)y ??(1) wherein each R1, R2, R3 and R4 is an independently selected substituted or unsubstituted hydrocarbyl group, with the proviso that in one molecular at least two of R1, R2, and R3 are aryl groups; and x and y are each from >0 to <1 such that x+y=1; and a linear structure having the general formula (2): (R5R6SiO2/2) ??(2) wherein R5 and R6 are each independently selected substituted or unsubstituted hydrocarbyl groups. End use applications and related methods of the silicone resin-linear copolymer are also disclosed.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: A flexible laminate, in which it is possible to achieve both flexibility and durability, is disclosed. A flexible display using the flexible laminate is also disclosed. The flexible laminate includes one or more units of a laminate structure in which two hard layers interposing one or more intermediate layers therebetween are bonded together as one unit. The intermediate layer has viscoelasticity. When the flexible laminate is bent, a neutral plane is formed in each inner portion of the hard layers that are bonded together to interpose the intermediate layer therebetween.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A silicone resin-linear copolymer is disclosed which has a resinous structure (A1) including R1SiO3/2 units, and a linear structure (A2) including repeated R22SiO2/2 units, wherein R1 is a propyl group and each R2 is an independently selected substituted or unsubstituted hydrocarbyl group, and wherein the resinous structure (A1) and the linear structure (A2) are bonded together in the silicone resin-linear copolymer via a siloxane bond.

Abstract: The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

Abstract: A flexible laminate for which increased flexibility and improved durability can coexist, and a flexible display provided with same, are disclosed. The flexible laminate has at least one unit of a laminated structure in which two hard layers closely adhere to each other with at least one intermediate layer therebetween. When the flexible laminate is bent, neutral planes are formed inside each of the hard layers that closely adhere to each other with the intermediate layer therebetween. The flexible laminate satisfies the following expression: a×In (tan ?×ET/0.01)?100. In the expression, a is any value ranging from 200 to 2,000, tan ? represents a loss factor for a substance configuring the intermediate layer, and ET represents an elastic modulus (MPa) of the substance configuring the intermediate layer.

Abstract: An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.

Abstract: An organic silicon compound is disclosed which is represented by a formula : (R13SiO)3SiR2-[SiR32O]y[SiR32]w-R4-R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

Abstract: The present invention relates to a copolymer having a specified carbosiloxane dendrimer structure and a long-chain alkyl group with 14 to 22 carbon atoms in a specified ratio, and a cosmetic comprising the copolymer as a cosmetic raw material. The cosmetic raw material has good miscibility with other cosmetic raw materials, and therefore, can improve stability of the formulation in a cosmetic, as well as can provide good water resistance, sebum resistance, glossiness, tactile sensation and/or adhesive properties to the hair and/or skin to a cosmetic, and also provide a cosmetic formed by blending the aforementioned cosmetic raw material, which exhibits superior surface protective properties, outer appearance and/or sensation during use.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) an adhesion promoter represented by the average unit formula; and (D) a hydrosilylation reaction catalyst. Provided is a curable silicone composition for forming a transparent cured product having high adhesion to a substrate, and an optical semiconductor device having excellent reliability made using the composition.

Abstract: A co-modified organopolysiloxane having a viscosity at 25° C. of not more than 1,500 mPa·s, a group that has a siloxane dendron structure, a hydrophilic group, and expressed by the following general formula (1): R1aR2bL1cQdSiO(4-a-b-c-d)/2 (1). The invention also relates to a powder treatment agent, a powder in oil dispersion, an external use preparation (particularly a cosmetic composition) composition comprising the co-modified organopolysiloxane. In said general formula (1), R1 is a monovalent hydrocarbon group or a hydrogen atom; R2 is a monovalent hydrocarbon group having from 6 to 30 carbons; L1 is a silylalkyl group having a siloxane dendron structure; and Q is a hydrophilic segment.

Abstract: The present invention provides a novel organopolysiloxane in which a rich hydrophilic property is exhibited, not only superior miscibility with a hydrophilic component and but also a hydrophobic property are exhibited, and superior miscibility with both a silicone oil and a non-silicone oil such as a hydrocarbon oil, an ester oil or the like, and provide various usages of the aforementioned novel organopolysiloxane by developing the superior characteristics thereof such as good surface activity power, a distinctive sensation during use, increased stability and the like. A co-modified organopolysiloxane having a specified chemical structure in which a sugar alcohol-modified group and a long-chain hydrocarbon group are present in one molecule is produced.

Abstract: A liquid organopolysiloxane having fluidity at least 100° C., a silicon-bonded glycerin derivative group, and a crosslinked structure comprising a carbon-silicon bond at the crosslinking portion.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Abstract: An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition and a compound having a highly dielectric functional group.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C1) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

Abstract: An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

Abstract: An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.