Patents by Inventor Haruhiko Hieda

Haruhiko Hieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connection structure for coaxial connector and multilayer substrate
    Patent number: 7471174
    Abstract: In the structure for connecting a board and a coaxial connector, which electrically connects a high-frequency board 20 mounted in an electroconductive casing 1 and a coaxial connector 10, a transfer board 30 is disposed between the high-frequency board 20 and the coaxial connector 10, and the high-frequency board 20 and the coaxial connector 10 are electrically connected through the transfer board 30.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: December 30, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Haruhiko Hieda, Hideki Asao
  • Connection structure for coaxial connector and multilayer substrate
    Publication number: 20060049491
    Abstract: In the structure for connecting a board and a coaxial connector, which electrically connects a high-frequency board 20 mounted in an electroconductive casing 1 and a coaxial connector 10, a transfer board 30 is disposed between the high-frequency board 20 and the coaxial connector 10, and the high-frequency board 20 and the coaxial connector 10 are electrically connected through the transfer board 30.
    Type: Application
    Filed: March 12, 2004
    Publication date: March 9, 2006
    Inventors: Haruhiko Hieda, Hideki Asao