Patents by Inventor Haruhiko Hirosue

Haruhiko Hirosue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6835348
    Abstract: A polyimide film F is brought into an intimate contact with a molding die 3 having a concave molding surface 3a so as to tightly close the open end thereof, and the polyimide film F is bent to deform only by the pressure difference of gas while being heated in a contactless manner. Molding is conducted by applying depressurization for a space 8 on the side of the molding die 3 relative to the polyimide film F while pressurizing the space 9 on the opposite side for the pressure difference at least in the final stage of the bending deformation so as to be in intimate contact with the concave molding surface 3a.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: December 28, 2004
    Assignees: Mogami Denki Corporation, Dupont-Toray Co., Ltd.
    Inventors: Haruhiko Hirosue, Shigeo Shibata, Hideaki Machida
  • Publication number: 20020160214
    Abstract: A polyimide film F is brought into an intimate contact with a molding die 3 having a concave molding surface 3a so as to tightly close the open end thereof, and the polyimide film F is bent to deform only by the pressure difference of gas while being heated in a contactless manner. Molding is conducted by applying depressurization for a space 8 on the side of the molding die 3 relative to the polyimide film F while pressurizing the space 9 on the opposite side for the pressure difference at least in the final stage of the bending deformation so as to be in intimate contact with the concave molding surface 3a.
    Type: Application
    Filed: September 10, 2001
    Publication date: October 31, 2002
    Inventors: Haruhiko Hirosue, Shigeo Shibata, Hideaki Machida