Patents by Inventor Haruhiko IWABUCHI

Haruhiko IWABUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11764132
    Abstract: A semiconductor device according to an embodiment comprises a semiconductor element, a first terminal, a plurality of second terminals, and an encloser. The semiconductor element is rectangular. The first terminal has an upper surface to which a back surface of the semiconductor element is bonded. The second terminals are arranged around the first terminal. The second terminals are arranged at four corners of the encloser to be exposed from the bottom surface, and sides of the semiconductor element are opposed to the first side, the second side, the third side, and the fourth side, respectively. The first terminal is apart from the first side surface and the third side surface, a lower surface of the first terminal is exposed from the bottom surface, and the first terminal is partly exposed from the second side surface and the fourth side surface.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: September 19, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Haruhiko Iwabuchi
  • SEMICONDUCTOR DEVICE
    Publication number: 20220285250
    Abstract: A semiconductor device according to an embodiment comprises a semiconductor element, a first terminal, a plurality of second terminals, and an encloser. The semiconductor element is rectangular. The first terminal has an upper surface to which a back surface of the semiconductor element is bonded. The second terminals are arranged around the first terminal. The second terminals are arranged at four corners of the encloser to be exposed from the bottom surface, and sides of the semiconductor element are opposed to the first side, the second side, the third side, and the fourth side, respectively. The first terminal is apart from the first side surface and the third side surface, a lower surface of the first terminal is exposed from the bottom surface, and the first terminal is partly exposed from the second side surface and the fourth side surface.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Inventor: Haruhiko IWABUCHI
  • Semiconductor device
    Patent number: 11373937
    Abstract: A semiconductor device according to an embodiment comprises a semiconductor element, a first terminal, a plurality of second terminals, and an encloser. The semiconductor element is rectangular. The first terminal has an upper surface to which a back surface of the semiconductor element is bonded. The second terminals are arranged around the first terminal. The second terminals are arranged at four corners of the encloser to be exposed from the bottom surface, and sides of the semiconductor element are opposed to the first side, the second side, the third side, and the fourth side, respectively. The first terminal is apart from the first side surface and the third side surface, a lower surface of the first terminal is exposed from the bottom surface, and the first terminal is partly exposed from the second side surface and the fourth side surface.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: June 28, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventor: Haruhiko Iwabuchi
  • SEMICONDUCTOR DEVICE
    Publication number: 20210296215
    Abstract: A semiconductor device according to an embodiment comprises a semiconductor element, a first terminal, a plurality of second terminals, and an encloser. The semiconductor element is rectangular. The first terminal has an upper surface to which a back surface of the semiconductor element is bonded. The second terminals are arranged around the first terminal. The second terminals are arranged at four corners of the encloser to be exposed from the bottom surface, and sides of the semiconductor element are opposed to the first side, the second side, the third side, and the fourth side, respectively. The first terminal is apart from the first side surface and the third side surface, a lower surface of the first terminal is exposed from the bottom surface, and the first terminal is partly exposed from the second side surface and the fourth side surface.
    Type: Application
    Filed: September 14, 2020
    Publication date: September 23, 2021
    Inventor: Haruhiko IWABUCHI