Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver, provided with a heat-generating body on an external wall, to transfer heat to an internal wall. The heatsink apparatus includes an inlet pipe supplying the working fluid to the heat receiver, an outlet pipe discharging vapor, into which the working fluid supplied to the heat receiver is evaporated by heat, and a heat dissipater dissipating heat of the vapor passing through the outlet pipe. An opening portion of the inlet pipe is opposite to and near the internal wall so as cause the working fluid near the internal wall to flow.

Abstract: A multilayer made up of a support member with first electrodes including a plurality of electrodes arranged in parallel to each other and the second electrodes including a plurality of electrodes that are arranged parallel to each other so as to cross the first electrodes. The multilayer also includes a protective layer (a front member) that is provided opposite one side of the support member and with which a predetermined position pointing member is brought into contact, and a reinforcing material (a rear member) provided opposite the other side of the support member. A gas layer (space) is provided between the first electrodes or the second electrodes and at least one of the support member, the protective layer (the front member), and the reinforcing material (the rear member), thereby blocking electrical coupling paths that increase electrostatic capacitance.

Abstract: There is provided a multilayer made up of: a support member 11 with first electrodes 3 including a plurality of electrodes arranged parallel to each other and the second electrodes 4 including a plurality of electrodes that are arranged parallel to each other so as to cross the first electrodes 3; a protective layer (a front member) 12 that is provided opposite one side of the support member 11 and with which a predetermined position pointing member is brought into contact; and a reinforcing material (a rear member) 13 provided opposite the other side of the support member 11. A gas layer (space) 15 is provided between the first electrodes 3 or the second electrodes 4 and at least one of the support member 11, the protective layer (the front member) 12, and the reinforcing material (the rear member) 13, thereby blocking electrical coupling paths that increase electrostatic capacitance C.

Abstract: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

Abstract: An inflow nozzle is disposed perpendicularly to plate-shaped fins of a heat-receiving section which is caused to face a heat-generating body to be cooled to draw heat therefrom, and portions of the plate-shaped fins are formed in a substantially V-shape or a substantially U-shape. Moreover, by selecting a proper dimension ratio of the thickness of a heat-receiving plate facing the heat-generating body and the length of the heat generating body, the heat absorption performance of the cooling device can be improved, and the cooling of the electronic component which generates high-temperature heat can be performed efficiently.