Abstract: A compound represented by the general formula: ##STR1## wherein Y represents a nitrogen atom or C-G (G represents a carboxyl group which may be esterified); ring R is a nitrogen-containing unsaturated heterocyclic group which may be substituted for; each of rings A and B may have a substituent; n represents an integer from 1 to 4; k represents the integer 0 or 1, or a salt thereof, which serves well as an anti-inflammatory agent, particularly a therapeutic agent for arthritis.

Abstract: A compound represented by the general formula: ##STR1## wherein Y represents a nitrogen atom or C--G (G represents a carboxyl group which may be esterified); ring R is a nitrogen-containing unsaturated heterocyclic group which may be substituted for; each of rings A and B may have a substituent; n represents an integer from 1 to 4; k represents the integer 0 or 1, or a salt thereof, which serves well as an anti-inflammatory agent, particularly a therapeutic agent for arthritis.

Abstract: This invention provides an anti-inflammatory agent, particularly an agent for treating arthritis, and a bone resorption inhibiting agent, containing a thienopyridine or thienopyrimidine derivative or a salt thereof. This invention also provides a novel thienopyridine or thienopyrimidine derivative having anti-inflammatory activity and bone resorption inhibiting activity.

Abstract: A ultra thin resin mold semiconductor device can be provided. A resin mold type semiconductor device is arranged so that a semiconductor chip is disposed within a range of the thickness of a lead frame and sealed with a resin mold, that the thickness of the semiconductor device is defined by the thickness of the lead frame, and that an upper surface, a lower surface and a side surface of a terminal portion formed by the lead frame are exposed from the surface of the resin mold.

Abstract: This invention provides an anti-inflammatory agent, particularly an agent for treating arthritis, containing a quinoline or quinazoline derivative or a salt thereof ##STR1## wherein Y is a nitrogen atom or C--G in which G is an optionally esterified carboxyl group;R.sup.1 and R.sup.2 are each independently a hydrogen atom, optionally substituted hydrocarbon group or optionally substituted heterocyclic group, or R.sup.1 and R.sup.2 are linked together to form a saturated ring;each of the ring A and ring B may optionally be substituted;n is an integer of 1 to 4; andk is 0 or 1.This invention also provides a novel quinoline or quinazoline derivative having anti-inflammatory activity.

Abstract: The present invention provides a novel quinoline derivative useful as an anti-inflammatory agent, particularly an agent for treating arthritis, or a salt thereof. The present invention also provides a composition, particularly an anti-inflammatory composition for pharmaceutical use, comprising the novel quinoline compound of formula (I): ##STR1## wherein G is an acyl group, optionally protected hydroxyalkyl group, amidated carboxyl group or halogen atom;X is an oxygen atom, optionally oxidized sulfur atom or --(CH.sub.2).sub.q -- in which q is an integer of 0 to 5;R is an optionally substituted amino group or optionally substituted heterocyclic group;each of the ring A and ring B may optionally be substituted; andk is 0 or 1.

Abstract: A compound represented by the general formula: ##STR1## wherein Y represents a nitrogen atom or C--G (G represents a carboxyl group which may be esterified); ring R is a nitrogen-containing unsaturated heterocyclic group which may be substituted or unsubstituted; each of rings A and B may have a substituent; n represents an integer from 1 to 4; k represents the integer 0 or 1, or a salt thereof, which serves well as an anti-inflammatory agent, particularly a therapeutic agent for arthritis.

Abstract: A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.