Patents by Inventor Haruhiko Morita

Haruhiko Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10792102
    Abstract: A laser tip, a laser treatment tool, a laser treatment device and a laser treatment system are provided for performing laser treatment surgery and minimizing any bleeding. A laser tip is attachable to a laser radiation opening located at the tip end of a laser transmission tube. The laser tip includes an attaching portion detachable from the laser radiation opening and a contact portion contactable with biological tissue. The contact portion is at the front of the attaching portion in the direction in which the laser light exits the laser radiation opening. An open space is located between the contact portion and the attaching portion, and a coupler couples a part of the contact portion and a part of the attaching portion. The contact portion has a reflective surface at a rear end thereof which reflects the laser light toward the coupler.
    Type: Grant
    Filed: March 18, 2018
    Date of Patent: October 6, 2020
    Assignees: J. Morita Mfg. Corp., National University Corporation Kobe University
    Inventors: Yoshihide Okagami, Akihito Hongo, Yoshiteru Tamura, Katsumi Hiyoshi, Haruhiko Murakami, Takeshi Azuma, Yoshinori Morita
  • Publication number: 20200287452
    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200286678
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10756589
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 25, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20200161919
    Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20200083769
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075223
    Abstract: A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075224
    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200076263
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20190387613
    Abstract: A method for manufacturing a printed wiring board includes laminating a first insulative resin layer including low dielectric constant material on a first surface of a base substrate, forming a first conductive layer including a metal foil on the first insulative resin layer, laminating a second insulative resin layer including prepreg material on a second surface of the base substrate on the opposite side with respect to the first surface, and forming a second conductive layer including a metal foil on the second insulative resin layer. The first insulative resin layer is formed such that a dielectric constant of the first insulative resin layer is set lower than a dielectric constant of the second insulative resin layer.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Ryuzo NISHIKAWA, Haruhiko MORITA
  • Publication number: 20190376088
    Abstract: The present invention provides a method of treating a disease associated with elevated KRAS activity or expression in a subject, comprising suppressing KRAS expression in the subject by targeting an expression regulatory region of KRAS gene using a CRISPR-Guide Nucleotide Directed Modulation (GNDM). Also, provided is a CRISPR-GNDM system for suppressing KRAS expression comprising (a) a protein selected from the group consisting of dCas9 or dCpf1, a fusion protein of dCas9 or dCpf1 and Kruppel associated box (KRAB), and (b) a guide nucleotide targeting an expression regulatory region of KRAS gene.
    Type: Application
    Filed: February 7, 2018
    Publication date: December 12, 2019
    Applicant: EdiGENE Corporation
    Inventors: Tetsuya YAMAGATA, Yuanbo QIN, Haruhiko MORITA, Talha AKBULUT, lain Robert THOMPSON
  • Publication number: 20190346153
    Abstract: A heating and hot water supplying device is provided. The device comprising: a circulation passage that connects a heat exchanger and an external heating terminal; a bypass passage that bypasses the heating terminal by branching from the circulation passage; a hot water supply passage for supplying the hot water heated to a preset hot water supply temperature by the heat exchanger for hot water supply; a control unit that controls operations in which this plurality of units are used; and an operation unit for performing various operations. A distribution means is provided in the branching portion of the bypass passage. The distribution means adjusts the distribution ratio so that each of a heating operation, a hot water supplying operation, and a simultaneous heating and hot water supplying operation is possible. The operation unit is provided with a prohibit switch to prohibit the simultaneous heating and hot water supplying operation.
    Type: Application
    Filed: October 26, 2017
    Publication date: November 14, 2019
    Applicant: NORITZ CORPORATION
    Inventors: Yasushi MORITA, Yoshihisa KITANO, Yasutaka KURIYAMA, Hiroshi MORIMOTO, Midori YOKOYAMA, Haruhiko TAMADA
  • Publication number: 20190245401
    Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 8, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20190154304
    Abstract: In a heating and hot water supply device including a burning means, a first heat exchanger, a circulation passage for circulating a heating thermal medium, a circulation pump, a first bypass passage, a second heat exchanger for hot water supply, a hot water supply passage, a distribution means at a branching portion of the first bypass passage, and a second bypass passage bypassing the second heat exchanger, a flow rate adjustment means for adjusting a bypass flow rate in the second bypass passage is provided. The distribution means is capable of adjusting its distribution ratio for heating, or hot water supply, or simulataneous heating/hot water supply. All passage connection portions on the second heat exchanger were provided on its one side portion.
    Type: Application
    Filed: May 24, 2017
    Publication date: May 23, 2019
    Applicant: NORITZ CORPORATION
    Inventors: Yasutaka KURIYAMA, Yasushi MORITA, Hiroshi MORIMOTO, Midori YOKOYAMA, Yoshihisa KITANO, Haruhiko TAMADA
  • Publication number: 20190115130
    Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20190074745
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 7, 2019
    Applicant: IBIDEN CO. , LTD.
    Inventors: Haruhiko MORITA, Shinobu KATO, Hitoshi MIWA, Hisashi KATO, Toshihiko YOKOMAKU
  • Publication number: 20180374630
    Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
    Type: Application
    Filed: June 27, 2018
    Publication date: December 27, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 9930791
    Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 27, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Mitsuhiro Tomikawa, Kota Noda, Nobuhisa Kuroda, Haruhiko Morita
  • Publication number: 20180035534
    Abstract: A printed wiring board includes a base substrate, a first insulative resin layer laminated on first surface of the base substrate, and a first conductive layer laminated on the first insulative resin layer. The base substrate includes conductive layers and insulative resin layers, the base substrate, first insulative resin layer and first conductive layer include a high-frequency substrate portion including portion of an outermost conductive layer in the base substrate, portion of the first insulative resin layer and portion of the first conductive layer, the first conductive layer has wiring patterns including microstrip lines and the portion forming the high-frequency substrate portion, the first insulative resin layer has dielectric constant of 3.5 or lower and dielectric loss tangent of 0.005 or lower, and the wiring pattern is formed such that side surfaces of the wiring pattern are substantially parallel to a thickness direction of the first insulative resin layer.
    Type: Application
    Filed: July 27, 2017
    Publication date: February 1, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Ryuzo NISHIKAWA, Haruhiko MORITA
  • Patent number: 9821035
    Abstract: The purpose of the present invention is to provide a preparation for preventing or treating type I diabetes, said preparation exerting an excellent effect of preventing or treating type I diabetes, and a method for preventing or treating type I diabetes. The onset and symptoms of type I diabetes can be very remarkably relieved by dosing a combination of: (A) at least one member selected from the group consisting of proinsulin, insulin, insulin A chain, insulin B chain, fragments thereof and variants thereof; with (B) ?-GalCer.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: November 21, 2017
    Assignee: REGIMMUNE CORPORATION
    Inventors: Omar Duramad, Hidetoshi Akimoto, Yasuyuki Ishii, Haruhiko Morita