Patents by Inventor Haruhiko Morita

Haruhiko Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11756721
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: September 12, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11710996
    Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: July 25, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11695309
    Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: July 4, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11658534
    Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: May 23, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11591621
    Abstract: The present invention provides a method of treating a disease associated with elevated KRAS activity or expression in a subject, comprising suppressing KRAS expression in the subject by targeting an expression regulatory region of KRAS gene using a CRISPR-Guide Nucleotide Directed Modulation (GNDM). Also, provided is a CRISPR-GNDM system for suppressing KRAS expression comprising (a) a protein selected from the group consisting of dCas9 or dCpf1, a fusion protein of dCas9 or dCpf1 and Kruppel associated box (KRAB), and (b) a guide nucleotide targeting an expression regulatory region of KRAS gene.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: February 28, 2023
    Assignee: Modalis Therapeutics Corporation
    Inventors: Tetsuya Yamagata, Yuanbo Qin, Haruhiko Morita, Talha Akbulut, Iain Robert Thompson
  • Patent number: 11588364
    Abstract: A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: February 21, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11557932
    Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: January 17, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Patent number: 11439692
    Abstract: The present invention provides a method of treating a disease associated with activated MYD88 signaling in a subject, including suppressing MYD88 expression in a subject by targeting an expression regulatory region of MYD88 gene by using a CRISPR-Guide Nucleotide Directed Modulation (GNDM), without affecting the expression of an adjacent ACAA1 gene. Also, provided is a CRISPR-GNDM system for suppressing MYD88, including expression comprising (a) a protein selected from the group consisting of dCas9 or dCpf1, a fusion protein of dCas9 or dCpf1 and Kruppel associated box (KRAB) and (b) a guide RNA (gRNA) targeting an expression regulatory region of MYD88 gene.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: September 13, 2022
    Assignee: Modalis Therapeutics Corporation
    Inventors: Tetsuya Yamagata, Yuanbo Qin, Iain Robert Thompson, Haruhiko Morita
  • Publication number: 20220123616
    Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 21, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20220115927
    Abstract: A coil substrate includes a flexible substrate having a first end and a second end, and coils formed on the substrate such that the coils extend from the first end to the second end of the substrate. The coils are formed such that each coil includes a center space and a wiring formed around the center space, each coil is formed such that the wiring includes one or more first wirings, one or more second wirings facing the first wiring(s) via the center space, and one or more third wirings connecting the first and second wiring(s) and that the first wiring(s) is positioned closer to the first end than the second wiring(s), and the wiring in each coil is formed such that a width w1 of the first wiring(s), a width w2 of the second wiring(s), and a width w3 of the third wiring(s) are substantially equal to each other.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 14, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20220110210
    Abstract: A coil substrate includes a first flexible substrate, a coil formed on the first flexible substrate, a second flexible substrate extending from the first flexible substrate, and a wiring that is formed on the second flexible substrate and is electrically connected to the coil formed on the first flexible substrate. The second flexible substrate includes a first portion extending from the first flexible substrate and a second portion extending from the first portion such that the second portion is formed along the first flexible substrate and that the second flexible substrate forms a gap between the second portion and the first flexible substrate.
    Type: Application
    Filed: September 29, 2021
    Publication date: April 7, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 11283317
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: March 22, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20220078912
    Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 10, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20220069657
    Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.
    Type: Application
    Filed: August 20, 2021
    Publication date: March 3, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 11264855
    Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: March 1, 2022
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20220060074
    Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 24, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20220021262
    Abstract: A motor coil substrate includes a flexible substrate, and coils formed on the flexible substrate. The flexible substrate is wound N times where N is 2 or larger, the coils are formed in a multiple of 3, the flexible substrate includes a first flexible substrate and a second flexible substrate extending from the first flexible substrate and wound around the first flexible substrate, the flexible substrate has a first end and a second end on an opposite side with respect to the first end such that the first flexible substrate has a first end of the flexible substrate, the second flexible substrate is positioned on an outer side of the first flexible substrate, and the coils are formed such that a coil or coils formed on the first flexible substrate partially overlap with a coil or coils formed on the second flexible substrate.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 20, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 11201515
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 14, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Hitoshi Miwa, Shinobu Kato, Toshihiko Yokomaku, Hisashi Kato, Takahisa Hirasawa, Tetsuya Muraki, Takayuki Furuno
  • Publication number: 20210260170
    Abstract: The present invention provides a method of treating a disease associated with activated MYD88 signaling in a subject, including suppressing MYD88 expression in a subject by targeting an expression regulatory region of MYD88 gene by using a CRISPR-Guide Nucleotide Directed Modulation (GNDM), without affecting the expression of an adjacent ACAA1 gene. Also, provided is a CRISPR-GNDM system for suppressing MYD88, including expression comprising (a) a protein selected from the group consisting of dCas9 or dCpf1, a fusion protein of dCas9 or dCpf1 and Kruppel associated box (KRAB) and (b) a guide RNA (gRNA) targeting an expression regulatory region of MYD88 gene.
    Type: Application
    Filed: May 17, 2018
    Publication date: August 26, 2021
    Inventors: Tetsuya YAMAGATA, Yuanbo QIN, lain Robert THOMPSON, Haruhiko MORITA
  • Patent number: 10978926
    Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: April 13, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku