Abstract: A grain oriented electrical steel sheet includes a base steel sheet, a glass film, and a tension-insulation coating. When a glow discharge emission spectroscopy is conducted from a surface of the glass film toward a depth direction, an analysis starting time Ts, a time TAlp at which Al shows a maximum emission intensity, an Al emission intensity F(TAlp) at the TAlp, a time TSip at which Si shows a maximum emission intensity, and an Al emission intensity F(TSip) at the TSip satisfy 0.05?F(TSip)/F(TAlp)?0.50 and 2.0?(TAlp?Ts)/(TSip?Ts)?5.0.

Abstract: Disclosed is a process for producing a highly reactive modified phenolic resin, which comprises mixing a heavy oil or pitch with 0.3 to 10 mol of a phenol, 0.2 to 9 mol in terms of formaldehyde, of a formaldehyde compound and 0.01 to 3.0 mol of an acid catalyst, each amount being based on 1 mol of the heavy oil or pitch calculated from an average molecular weight; and heating the resulting mixture with stirring, thereby to polycondensate the heavy oil or pitch, phenol and formaldehyde compound. According to this invention, there can be provided a process for producing simply and stably a highly reactive modified phenolic resin having low melt viscosity, excellent heat resistance and high reactivity with an epoxy resin, in one step.

Abstract: Disclosed is a process for producing a highly reactive modified phenolic resin, which comprises mixing a heavy oil or pitch with 0.3 to 10 mol of a phenol, 0.2 to 9 mol in terms of formaldehyde, of a formaldehyde compound and 0.01 to 3.0 mol of an acid catalyst, each amount being based on 1 mol of the heavy oil or pitch calculated from an average molecular weight; and heating the resulting mixture with stirring, thereby to polycondensate the heavy oil or pitch, phenol and formaldehyde compound. According to this invention, there can be provided a process for producing simply and stably a highly reactive modified phenolic resin having low melt viscosity, excellent heat resistance and high reactivity with an epoxy resin, in one step.

Abstract: A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

Abstract: A process for producing a modified phenolic resin comprises heating (a) petroleum heavy oil or pitch and (b) a formaldehyde polymer in a molar ratio of formaldehyde:oil or pitch of from 1 to 15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol:oil or pitch of from 0.5 to 5:1 to form a crude modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon to remove unreacted components and (ii) an extraction with a solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.