Patents by Inventor Haruhiko TAKEMOTO

Haruhiko TAKEMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, intelligent power module and power conversion apparatus
    Patent number: 11114836
    Abstract: The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: September 7, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Fumitaka Tametani, Manabu Matsumoto, Haruhiko Takemoto, Hiroshi Yoshida, Motonobu Joko
  • SEMICONDUCTOR DEVICE, INTELLIGENT POWER MODULE AND POWER CONVERSION APPARATUS
    Publication number: 20170063071
    Abstract: The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.
    Type: Application
    Filed: April 8, 2016
    Publication date: March 2, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Rei YONEYAMA, Fumitaka TAMETANI, Manabu MATSUMOTO, Haruhiko TAKEMOTO, Hiroshi YOSHIDA, Motonobu JOKO