Abstract: A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to close the opening, a first chip mounted on the upper surface of the thin film, and a second chip mounted on the under surface of the thin film so as to be located in the opening of the rigid substrate. The rigid substrate and the thin film form a wiring substrate having a composite structure.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract: To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.

Abstract: An anti-airlock apparatus for filters comprises a process bath for processing wafers, a filtration unit incorporating a filter for preliminarily filtering a process solution before said processing and connected to a first deaeration line, and a tank body provided on the primary side or the filtration unit and connected to a second deaeration line, wherein at least said filtration unit and tank body are connected to each other via a pipeline, and a valve of the first deaeration line and a valve of the second deaeration line are separately operated and said first and second deaeration lines are directly connected to the most upstream side of the process solution.

Abstract: The present invention prevents deposition on product wafers of microbubbles generated from chemical solution circulation systems for wet etching or wet cleaning, or pure water supply systems during manufacturing processes of semiconductors or liquid crystals. A separator is provided on the inner wall of a chemical solution bath for etching or cleaning wafers to cover a process solution nozzle. The separator comprises an upper microbubble discharge tube extending upright for discharging microbubbles and lower outlets for horizontally introducing a process solution into the process bath.

Abstract: A method of removing particles adhering to a surface of a semiconductor wafer including the steps of: providing a container having a drain valve; positioning the semiconductor wafer in the container; directing a jet stream consisting of water against the surface of the semiconductor wafer; removing particles adhering to the surface of the semiconductor wafer by scrubbing the surface of the semiconductor wafer with a brush while the jet stream of water is directed against the surface of the semiconductor wafer; closing the drain valve while the jet stream of water is directed against the semiconductor wafer, wherein the water accumulates in the container to thereby completely immerse the brush and the semiconductor wafer in the water in the container; and maintaining the brush and the semiconductor wafer completely immersed in the water from the jet stream for a predetermined period of time.

Abstract: An object of the present invention is to prevent erroneous operation of a liquid level sensor due to deposition of ammonium fluoride dissolved in buffered hydrofluoric acid used as a process solution.The present invention provides a liquid level sensor comprising a chemical solution bath for receiving a chemical solution including buffered hydrofluoric acid, a gas feed tube for introducing a gas for detecting the variation in the liquid level of said chemical solution into said chemical solution, and a gas pressure detector for detecting a change in the pressure of said gas and converting it into an electric signal to indicate a change in liquid level, characterized in that the diameter of a gas outlet provided at an end of said gas feed tube is smaller than the inner diameter of said gas feed tube.

Abstract: A semiconductor module includes a plurality of elementary chip assemblies stacked with each other, wherein each of the elementary chip assemblies includes a semiconductor chip and a thermally conductive substrate supporting the semiconductor chip thereon. The elementary chip assemblies are stacked in a manner such that the bottom edge of the semiconductor chips are aligned to form a bottom surface of the semiconductor module, and interconnection electrodes are provided on the bottom surface.

Abstract: A cooling system used with a printed circuit board has at least a solid circuit component thereon. The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engage to each of the components. The cooling module has a heat transfer plate connected to one end of a bellows which is connected to the cooling header at the other end. A layer of thermally conductive compound, such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted on the circuit component provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically.

Abstract: A cooling system comprising an airtight box which accommodates a cooling module and an electronic device which is cooled by the cooling module and has a door which is opened when attending to maintenance of parts within the airtight box, a dew condensation preventing unit for absorbing humidity within the airtight box and/or replacing air or gas within said airtight box when operated, a coolant supply unit for recirculating a coolant between the coolant supply unit and the cooling module, and a controller for operating the coolant supply unit and the dew condensation preventing unit in response to a first instruction signal which instructs a cooling operation, and for heating the electronic device in response to a second instruction signal which instructs the maintenance of the parts within the airtight box, where only one of the first and second instruction signals exists at one time.

Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.

Abstract: A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.

Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: An apparatus for circulating cooling fluid through a plurality of cooling modules for cooling electronic components, such as IC'S or LSI'S. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules. Each of the supply systems includes a fluid line connected to a single tank containing cooling fluid and is provided with a pump and a heat exchanger, so that the cooling fluid in the tank is circulated through the respective cooling modules and returned to the tank, in which the cooling fluid is then mixed.

Abstract: A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A cooling system for an electronic apparatus which cools the electronic apparatus using a plurality of cooling fans and controls the rotational speed of the cooling fans in accordance with the temperature of apparatus to be cooled or the temperature of the inlet air or the air to be exhausted. Operation of the electronic apparatus may be continued with high reliability even when one or more fans fail by using simplified circuitry which causes other normal cooling fans to operate at full speed.

Abstract: A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.