Patents by Inventor Haruhisa Koike

Haruhisa Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device and manufacturing method thereof
    Patent number: 8334158
    Abstract: In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: December 18, 2012
    Assignee: DENSO CORPORATION
    Inventors: Toshihiko Takahata, Takashige Saito, Masahiro Honda, Shinpei Taga, Haruhisa Koike
  • SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100224945
    Abstract: In manufacturing a sensor device, a sensor chip having a sensing portion on a surface thereof is mounted on one surface of a substrate, and a resin having a volatile property is arranged on the surface of the sensor chip, thereby covering the surface of the sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member. After that, the sealing member is cured, and the resin is heated to be vaporized so that a void is formed between a covered portion in the surface of the sensor chip, which is covered by the sealing member, and the sealing member.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 9, 2010
    Applicant: DENSO CORPORATION
    Inventors: Toshihiko TAKAHATA, Takashige SAITO, Masahiro HONDA, Shinpei TAGA, Haruhisa KOIKE
  • Electrical shield structure for pressure sensor
    Patent number: 7171856
    Abstract: A pressure sensor includes a case having a concave portion, a sensing portion disposed in the concave portion to output an electrical signal proportional to an applied pressure, a circuit portion disposed in the concave portion and connected to the sensing portion and a conductive diaphragm fixed to the case to cover the concave portion. A conductive member surrounds the sensing portion and the circuit portion to provide an electrical shield. The diaphragm is used as a part of the conductive member.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: February 6, 2007
    Assignee: Denso Corporation
    Inventors: Haruhisa Koike, Hironobu Baba, Nobuo Segawa
  • Electrical shield structure for pressure sensor
    Publication number: 20050199070
    Abstract: A pressure sensor includes a case having a concave portion, a sensing portion disposed in the concave portion to output an electrical signal proportional to an applied pressure, a circuit portion disposed in the concave portion and connected to the sensing portion and a conductive diaphragm fixed to the case to cover the concave portion. A conductive member surrounds the sensing portion and the circuit portion to provide an electrical shield. The diaphragm is used as a part of the conductive member.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 15, 2005
    Inventors: Haruhisa Koike, Hironobu Baba, Nobuo Segawa
  • Pressure sensor with a corrosion-resistant diaphragm
    Patent number: 6813953
    Abstract: A pressure sensor includes a sensor device and a diaphragm. The diaphragm is exposed to a fluid, a pressure relative to which is detected using the sensor device. The diaphragm is made of a material having a pitting index, which is defined by the equation, (Cr+3.3Mo+20N), of 50 or greater and Ni content of 30 weight % or greater to prevent the diaphragm from corroding due to the fluid.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: November 9, 2004
    Assignee: Denso Corporation
    Inventors: Hironobu Baba, Yukihiro Kato, Hiroshi Nomura, Haruhisa Koike
  • Pressure sensor with a corrosion-resistant diaphragm
    Publication number: 20030200813
    Abstract: A pressure sensor includes a sensor device and a diaphragm. The diaphragm is exposed to a fluid, a pressure relative to which is detected using the sensor device. The diaphragm is made of a material having a pitting index, which is defined by the equation, (Cr+3.3Mo+20N), of 50 or greater and Ni content of 30 weight % or greater to prevent the diaphragm from corroding due to the fluid.
    Type: Application
    Filed: April 21, 2003
    Publication date: October 30, 2003
    Inventors: Hironobu Baba, Yukihiro Kato, Hiroshi Nomura, Haruhisa Koike