Patents by Inventor Haruhisa Otsuka

Haruhisa Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Screen input type display device
    Patent number: 6721019
    Abstract: There is provided a highly reliable screen input type display device using a touch panel which can facilitate the control of a gap formed between upper and lower substrates and can stabilize the linearity of the resistance value detection of a resistance film, whereby an erroneous detection of coordinated can be eliminated. For this purpose, a tape-like conductive pressure sensitive adhesive member, which is formed by sandwiching a metal foil with conductive pressure sensitive adhesive material, is used at a connection portion between an upper wiring electrode mounted on an upper resistance film formed on an upper substrate and an inter-substrate connection wiring electrode formed on a lower substrate.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: April 13, 2004
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd., Hitachi Chiba Electronics, Ltd.
    Inventors: Masao Kono, Akira Kakinuma, Koji Ishii, Haruhisa Otsuka, Kazuo Ishii
  • Screen input type display device
    Publication number: 20010043291
    Abstract: The task of the present invention is to provide a highly reliable screen input type display device using a touch panel which can facilitate the control of a gap formed between upper and lower substrates and can stabilize the linearity of the resistance value detection of a resistance film whereby an erroneous operation of the coordinates detection can be eliminated. To solve such a task, a tape-like conductive pressure sensitive adhesive member which is formed by sandwiching a metal foil with conductive pressure sensitive adhesive material is used at a connection portion between an upper wiring electrode mounted on an upper resistance film formed on an upper substrate and an inter-substrate connection wiring electrode formed on a lower substrate.
    Type: Application
    Filed: April 20, 2001
    Publication date: November 22, 2001
    Inventors: Masao Kono, Akira Kakinuma, Koji Ishii, Haruhisa Otsuka, Kazuo Ishii