Patents by Inventor HARUKA SEKI

HARUKA SEKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9740129
    Abstract: Ferrite particles have, as a main component, a material represented by a composition formula MxFe3?xO4 (where M is at least one type of metal selected from a group made of Mg, Mn, Ca, Ti, Cu, Zn, Sr and Ni, 0<x<1), where the maximum height Rz of the particles falls within a range of 1.40 ?m to 1.90 ?m, and the degree of distortion Rsk of the particles falls within a range of ?0.25 to ?0.07. In this way, when the ferrite particles are used as the carrier of an electrophotographic image forming apparatus, even if an image formation speed is increased, the occurrence of a failure is reduced for a long period of time.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 22, 2017
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Shinya Sasaki, Yohei Ishikawa, Haruka Seki
  • Publication number: 20160266510
    Abstract: There are provided ferrite particles that have, as a main component, a material represented by a composition formula MxFe3-xO4 (where M is at least one type of metal selected from a group consisting of Mg, Mn, Ca, Ti, Cu, Zn, Sr and Ni, 0<x<1), where the maximum height Rz of the particles falls within a range of 1.40 to 1.90, and the degree of distortion Rsk of the particles falls within a range of ?0.25 to ?0.07. In this way, when the ferrite particles are used as the carrier of an electrophotographic image forming apparatus, even if an image formation speed is increased, the occurrence of a failure is reduced for a long period of time.
    Type: Application
    Filed: October 29, 2014
    Publication date: September 15, 2016
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Shinya SASAKI, Yohei ISHIKAWA, Haruka SEKI
  • Patent number: 9268246
    Abstract: Provided is a method for manufacturing carrier core particles for electrophotographic developer capable of stably maintaining high chargeability over a long time. The method for manufacturing carrier core particles includes a granulation step of granulating a mixture of raw materials containing manganese, iron, strontium, and calcium and a firing step of firing the mixture granulated in the granulation step. The firing step includes a heating process of heating the granular mixture with an increase in temperature to a predetermined degree and a cooling process of cooling the granular mixture, after the heating process, in an atmosphere with an oxygen concentration ranging from 5000 ppm to 20000 ppm. The molar ratio of the sum of strontium and calcium to the sum of the manganese, iron, strontium, and calcium is 0.0026 to 0.013.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: February 23, 2016
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Takeshi Kawauchi, Sho Ogawa, Haruka Seki
  • Publication number: 20140242511
    Abstract: Provided is a method for manufacturing carrier core particles for electrophotographic developer capable of stably maintaining high chargeability over a long time. The method for manufacturing carrier core particles includes a granulation step of granulating a mixture of raw materials containing manganese, iron, strontium, and calcium and a firing step of firing the mixture granulated in the granulation step. The firing step includes a heating process of heating the granular mixture with an increase in temperature to a predetermined degree and a cooling process of cooling the granular mixture, after the heating process, in an atmosphere with an oxygen concentration ranging from 5000 ppm to 20000 ppm. The molar ratio of the sum of strontium and calcium to the sum of the manganese, iron, strontium, and calcium is 0.0026 to 0.013.
    Type: Application
    Filed: February 20, 2014
    Publication date: August 28, 2014
    Applicants: DOWA IP CREATION CO., LTD., DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takeshi KAWAUCHI, SHO OGAWA, HARUKA SEKI