Patents by Inventor Haruka YAMAMOTO
Haruka YAMAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11649554Abstract: A method for producing metal titanium by carrying out electrolysis using an anode and a cathode in a molten salt bath, the method using an anode containing metal titanium as the anode, the method comprising a titanium deposition step of depositing metal titanium on the cathode, wherein, in the titanium deposition step, a temperature of the molten salt bath is from 250° C. or more and 600° C. or less, and an average current density of the cathode in a period from the start to 30 minutes later of the titanium deposition step is maintained in a range of 0.01 A/cm2 to 0.09 A/cm2.Type: GrantFiled: July 18, 2019Date of Patent: May 16, 2023Assignee: Toho Titanium Co., Ltd.Inventors: Matsuhide Horikawa, Daisuke Suzuki, Haruka Yamamoto, Hideki Fujii
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Publication number: 20220262690Abstract: A power module includes a base plate, a casing, a substrate unit, a terminal plate, a first resin layer, and a second resin layer. The substrate unit includes a substrate fixed on the base plate, a dam part, a semiconductor chip, a metal member, and a wire. The dam part is formed along an edge of the substrate. The wire includes an electrode plate connection portion, and a chip connection portion. The first resin layer is located inward of the dam part. The chip connection portion and the electrode plate connection portion are located inside the first resin layer. The second resin layer is located on the first resin layer. The upper surface of the metal member is located inside the second resin layer. An elastic modulus of the second resin layer is less than that of the first resin layer.Type: ApplicationFiled: September 13, 2021Publication date: August 18, 2022Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Keiichiro MATSUO, Izuru KOMATSU, Haruka YAMAMOTO
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Patent number: 11410914Abstract: A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.Type: GrantFiled: July 10, 2020Date of Patent: August 9, 2022Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Keiichiro Matsuo, Jun Karasawa, Haruka Yamamoto, Shinya Hayashiyama
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Patent number: 11370180Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.Type: GrantFiled: June 18, 2021Date of Patent: June 28, 2022Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Takahiro Aizawa, Takashi Ito, Masatoshi Tanabe, Haruka Yamamoto
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Publication number: 20220105693Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.Type: ApplicationFiled: June 18, 2021Publication date: April 7, 2022Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takahiro AIZAWA, Takashi ITO, Masatoshi TANABE, Haruka YAMAMOTO
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Publication number: 20220105692Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.Type: ApplicationFiled: June 18, 2021Publication date: April 7, 2022Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takashi ITO, Takahiro AIZAWA, Masatoshi TANABE, Haruka YAMAMOTO
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Patent number: 11292211Abstract: An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.Type: GrantFiled: June 18, 2021Date of Patent: April 5, 2022Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Takashi Ito, Takahiro Aizawa, Masatoshi Tanabe, Haruka Yamamoto
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Publication number: 20210310140Abstract: A method for producing metal titanium by carrying out electrolysis using an anode and a cathode in a molten salt bath, the method using an anode containing metal titanium as the anode, the method comprising a titanium deposition step of depositing metal titanium on the cathode, wherein, in the titanium deposition step, a temperature of the molten salt bath is from 250° C. or more and 600° C. or less, and an average current density of the cathode in a period from the start to 30 minutes later of the titanium deposition step is maintained in a range of 0.01 A/cm2 to 0.09 A/cm2.Type: ApplicationFiled: July 18, 2019Publication date: October 7, 2021Inventors: Matsuhide Horikawa, Daisuke Suzuki, Haruka Yamamoto, Hideki Fujii
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Publication number: 20210090974Abstract: A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.Type: ApplicationFiled: July 10, 2020Publication date: March 25, 2021Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Keiichiro MATSUO, Jun KARASAWA, Haruka YAMAMOTO, Shinya HAYASHIYAMA
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Publication number: 20200303273Abstract: A power module includes a housing including an external terminal exposed at an outer surface of the housing, a substrate provided inside the housing, a semiconductor element mounted to the substrate, a wire connected to the semiconductor element, a metal plate terminal provided inside the housing, and a gel material provided inside the housing; the metal plate terminal connects the external terminal to an electrode of the semiconductor element; and the gel material covers the wire, the semiconductor element, the substrate, and a portion of the metal plate terminal. The metal plate terminal includes a first portion disposed inside the gel material between the wire and a top plate of the housing, a second portion bent with respect to the first portion and connected to the electrode of the semiconductor element, and a third portion extending from an end portion of the first portion toward the substrate.Type: ApplicationFiled: March 9, 2020Publication date: September 24, 2020Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Haruka YAMAMOTO, Michinobu INOUE, Shinya HAYASHIYAMA
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Patent number: 10401172Abstract: An angular velocity acquisition device includes a movable body, a drive electrode to which a drive voltage is applied to vibrate the movable body in a first direction, at least one stopper that stops the movable body at a predetermined position, a hold electrode which receives a hold voltage to hold the movable body at the predetermined position, a detection unit that detects a predetermined physical quantity depending on an amplitude of the vibration of the movable body in a second direction based on a Coriolis force acting on the movable body that vibrates in the first direction, and an angular velocity calculation unit that calculates an angular velocity of the movable body based on the predetermined physical quantity detected by the detection unit.Type: GrantFiled: August 22, 2016Date of Patent: September 3, 2019Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Haruka Yamamoto, Yasushi Tomizawa, Tamio Ikehashi
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Patent number: 10330472Abstract: According to one embodiment, an angular velocity acquisition device includes a movable body that vibrates in a first direction and in a second direction that is based on Coriolis force and includes a movable electrode portion extending in the second direction, a hold electrode that extends in the second direction and includes a fixed electrode portion opposite to the movable electrode portion across a gap, and a stopper that is provided between the fixed electrode portion and the movable electrode portion and includes an end portion closer to the movable electrode portion than a surface of the fixed electrode portion facing the movable electrode portion.Type: GrantFiled: February 27, 2017Date of Patent: June 25, 2019Assignee: Kabushiki Kaisha ToshibaInventors: Yasushi Tomizawa, Haruka Yamamoto, Tamio Ikehashi
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Publication number: 20180003502Abstract: According to one embodiment, an angular velocity acquisition device includes a movable body that vibrates in a first direction and in a second direction that is based on Coriolis force and includes a movable electrode portion extending in the second direction, a hold electrode that extends in the second direction and includes a fixed electrode portion opposite to the movable electrode portion across a gap, and a stopper that is provided between the fixed electrode portion and the movable electrode portion and includes an end portion closer to the movable electrode portion than a surface of the fixed electrode portion facing the movable electrode portion.Type: ApplicationFiled: February 27, 2017Publication date: January 4, 2018Inventors: Yasushi TOMIZAWA, Haruka YAMAMOTO, Tamio IKEHASHI
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Publication number: 20170268878Abstract: An angular velocity acquisition device includes a movable body, a drive electrode to which a drive voltage is applied to vibrate the movable body in a first direction, at least one stopper that stops the movable body at a predetermined position, a hold electrode which receives a hold voltage to hold the movable body at the predetermined position, a detection unit that detects a predetermined physical quantity depending on an amplitude of the vibration of the movable body in a second direction based on a Coriolis force acting on the movable body that vibrates in the first direction, and an angular velocity calculation unit that calculates an angular velocity of the movable body based on the predetermined physical quantity detected by the detection unit.Type: ApplicationFiled: August 22, 2016Publication date: September 21, 2017Inventors: Haruka YAMAMOTO, Yasushi TOMIZAWA, Tamio IKEHASHI