Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A head unit includes: a circuit substrate, a casing including a cover for defining an accommodation space that accommodates the circuit substrate, and a flow passage member of which a part is disposed in the casing, including a flow passage coupling portion. The cover has an intake port for sucking air from an outside of the cover to the accommodation space and an exhaust port for exhausting the air passing through the accommodation space, and the flow passage coupling portion is disposed outside the casing and disposed closer to the intake port than to the exhaust port.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head that has an ejection surface including a first nozzle row configured to eject a first ink and a second nozzle row configured to eject a second ink. The liquid ejecting head is configured to be held in a first posture in which the ejection surface is inclined with respect to a horizontal plane. The dynamic surface tension of the first ink is higher than the dynamic surface tension of the second ink. In the first posture, the first nozzle row is positioned above the second nozzle row with respect to a gravity direction.

Abstract: A capacitor that includes: an insulating substrate having a first main surface and a second main surface; a capacitance forming part facing the first main surface, the capacitance forming part having a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line that includes a first via conductor penetrating the insulating substrate and connected to the conductive metal porous body; and a second external connection line that includes a second via conductor penetrating the insulating substrate, and an internal conductor covering the conductive film so as to fill a space inside the capacitance forming part, and the conductive film and the second via conductor are connected with at least the internal conductor interposed therebetween.

Abstract: A capacitor that includes: an insulating substrate having a first main surface and a second main surface opposite to the first main surface; a capacitance forming part facing the first main surface, the capacitance forming part comprising a conductive metal porous body, a dielectric film covering a surface of the metal porous body, and a conductive film covering the dielectric film; a first external connection line connected to the conductive metal porous body; a second external connection line connected to the conductive film; and a support part in the insulating substrate, the support part supporting the capacitance forming part and protruding from the first main surface toward the capacitance forming part, and surrounded by and joined to the capacitance forming part.

Abstract: There is provided a liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip ejecting a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method including: a replacing step of replacing the first head chip with a second head chip compatible with the first head chip, in which the replacing step includes a first step of releasing an adhesion state where the first selection coupling portion and the first head chip are liquid-tightly coupled, and a second step of liquid-tightly coupling the second selection coupling portion compatible with the first selection coupling portion and the second head chip by an adhesive.

Abstract: There is provided a liquid ejecting head including a head chip and a flow path structure to which the head chip is joined by a first-adhesive and a second-adhesive, in which the flow path structure has a common flow path, a first-selection-flow-path coupled to the common flow path and liquid-tightly coupled to the chip-side flow path of the head chip by the first-adhesive, and a second-selection-flow-path coupled to the common flow path, an outer surface of the flow path structure includes a closed region surrounding an opening of the second-selection-flow-path at a distance from the opening when viewed in a stacking direction of the head chip and the flow path structure, and the head chip adheres to the flow path structure via the second-adhesive in the closed region so that the second-selection-flow-path is closed.

Abstract: A manufacturing method of a liquid ejecting head is a manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head including a first head chip and a relay substrate including a terminal group ? and a terminal group ?, which are electrical coupling terminals to the first head chip. The manufacturing method includes a replacing step of replacing the first head chip with a second head chip compatible with the first head chip. The replacing step includes a first step of electrically separating the terminal group ? from the first head chip, and a second step of electrically coupling the terminal group ? that is compatible with the terminal group ? to the second head chip.

Abstract: A liquid ejecting head includes a flow path structure having a first coupling flow path, a first head chip having a second coupling flow path that communicates with first nozzles, and a first joint member having a first relay flow path that communicates with the first coupling flow path and the second coupling flow path, in which the first joint member is detachably fixed to the flow path structure so that the first coupling flow path and the first relay flow path are coupled to each other, and the second coupling flow path and the first relay flow path liquid-tightly communicate with each other via an adhesive disposed around an opening of the first relay flow path facing the second coupling flow path.

Abstract: A liquid ejecting head includes a first head chip that includes a first wiring member having flexibility, and a relay substrate that includes a first terminal group ? and is electrically coupled to the first wiring member. The first wiring member includes a first terminal group A that is adhered or bonded to the first terminal group ? of the relay substrate, and a first terminal group B that is not adhered or bonded to the relay substrate, and the first terminal group A is compatible with the first terminal group B.

Abstract: A liquid ejecting head includes head chips ejecting a liquid in a first-direction, a fixed plate having a flat plate portion to which the head chips are fixed, and a holder having a flow path forming portion provided with first-coupling-flow-paths that are open in the first-direction, the head chip has a flow path pipe in which a second-coupling-flow-path is provided and which protrudes in a second-direction opposite to the first-direction, and in a state where the flow path pipe is inserted into the first-coupling-flow-path, the first-coupling-flow-path communicates with the second-coupling-flow-path in a liquid-tight manner via an elastic sealing member disposed between an inner peripheral surface of the first-coupling-flow-path and an outer peripheral surface of the flow-path-pipe when viewed in the first-direction.

Abstract: A printing device includes: a medium support unit including a support surface configured to support at least a printing region of a medium; a medium accommodating unit configured to accommodate a region of the medium not supported by the support surface; a head configured to discharge a liquid onto the medium supported by the support surface; a first head moving unit configured to move the head in a first direction parallel to the support surface; a second head moving unit configured to move the head in a second direction that is parallel to the support surface and intersects the first direction; a maintenance unit performs maintenance of the head; and a maintenance cover configured to cover a side of the maintenance unit in the third direction configured to face the head in the maintenance unit.

Abstract: The X-ray imaging system according to the present embodiment includes an X-ray tube, a holding assembly, a flying object, an X-ray detector, and processing circuitry, The X-ray tube is configured to emit X-rays. The holding assembly is configured to hold the X-ray tube. The flying object is equipped with the holding assembly. The X-ray detector is configured to detect the X-rays emitted by the X-ray tube. The processing circuitry is configured to control a flight of the flying object, and to control the flight of the flying object such that the X-ray tube is arranged on a predetermined position with respect to the X-ray detector.

Abstract: A flow-path coupling member includes: first-face coupling portions each configured to be coupled to a corresponding one of flow paths of a first flow-path member; second-face coupling portions each configured to be coupled to a corresponding one of flow paths of a second flow-path member; coupling flow paths each connecting a corresponding one of the first-face coupling portions and a corresponding one of the second-face coupling portions; a first outer surface facing a first direction; and a second outer surface facing a second direction intersecting the first direction, the first-face coupling portions are provided in the first outer surface and arranged in the second direction, and the second-face coupling portions are provided in the second outer surface and arranged in the first direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.

Abstract: A head unit includes: a circuit substrate, a casing including a cover for defining an accommodation space that accommodates the circuit substrate, and a flow passage member of which a part is disposed in the casing, including a flow passage coupling portion. The cover has an intake port for sucking air from an outside of the cover to the accommodation space and an exhaust port for exhausting the air passing through the accommodation space, and the flow passage coupling portion is disposed outside the casing and disposed closer to the intake port than to the exhaust port.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head that has an ejection surface including a first nozzle row configured to eject a first ink and a second nozzle row configured to eject a second ink. The liquid ejecting head is configured to be held in a first posture in which the ejection surface is inclined with respect to a horizontal plane. The dynamic surface tension of the first ink is higher than the dynamic surface tension of the second ink. In the first posture, the first nozzle row is positioned above the second nozzle row with respect to a gravity direction.