Patents by Inventor Haruki Nitta

Haruki Nitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11152024
    Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: October 19, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shinobu Hagiya, Hiroyasu Tsuchida, Tzong-Shii Pan, Haruki Nitta, Yoshinobu Noguchi
  • Publication number: 20210304791
    Abstract: An approach to a piezoelectric (PZT) device, such as a hard disk drive microactuator, includes one or more layers of poled PZT material, with top and bottom surfaces coupled with respective electrode layers coupled with a power source to drive the active PZT layer(s). The electrode layers have different thicknesses, where the particular thicknesses may be configured to mitigate the variation of out-of-plane motion or bending associated with operational variations in the z-height between a corresponding actuator arm and recording medium and, likewise, the phase variation of flexure vibration.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 30, 2021
    Inventors: Shinobu Hagiya, Hiroyasu Tsuchida, Tzong-Shii Pan, Haruki Nitta, Yoshinobu Noguchi
  • Patent number: 8157170
    Abstract: Aimed is easy locating of a card placed on a touch panel, when identifying card type by sliding a touch pen, etc. along card slits. When a reference slit determining unit (404) of a card identification device (401) determines that a locus input from a touch panel unit (402) matches a reference slit, a slit region display control unit (405) displays longest slit regions images in which value slits are to be included on an image display unit (403). When a value slit determining unit (406) determines that a locus input thereafter matches any value slit, an input-finished slit display control unit (409) displays the image of the identified value slit on the image display unit (403), overlaying it on the longest slit region. When all value slits are identified, a card identifying unit (407) identifies the card type based on types of the identified value slits, and outputs it.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: April 17, 2012
    Assignee: Konami Digital Entertainment Co., Ltd.
    Inventor: Haruki Nitta
  • Publication number: 20100032484
    Abstract: Aimed is easy locating of a card placed on a touch panel, when identifying card type by sliding a touch pen, etc. along card slits. When a reference slit determining unit (404) of a card identification device (401) determines that a locus input from a touch panel unit (402) matches a reference slit, a slit region display control unit (405) displays longest slit regions images in which value slits are to be included on an image display unit (403). When a value slit determining unit (406) determines that a locus input thereafter matches any value slit, an input-finished slit display control unit (409) displays the image of the identified value slit on the image display unit (403), overlaying it on the longest slit region. When all value slits are identified, a card identifying unit (407) identifies the card type based on types of the identified value slits, and outputs it.
    Type: Application
    Filed: October 12, 2007
    Publication date: February 11, 2010
    Applicant: Konami Digital Entertainment Co, Ltd
    Inventor: Haruki Nitta
  • Patent number: 7479013
    Abstract: A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: January 20, 2009
    Assignee: U-AI Electronics Corporation
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno
  • Publication number: 20080282538
    Abstract: A method for manufacturing such a printed board with high efficiency is disclosed. The printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Application
    Filed: June 11, 2008
    Publication date: November 20, 2008
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno
  • Publication number: 20080076276
    Abstract: A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Application
    Filed: February 28, 2005
    Publication date: March 27, 2008
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno