Abstract: A vehicle state detection unit detects whether a vehicle including an information apparatus is in motion or stopped. A display control unit displays operation items related to various functions provided by the information apparatus on a display. A function execution unit executes a function corresponding to a selected operation item. An identification unit identifies the frequency of use of each operation item by classifying the items according to whether the vehicle is in motion or stopped. The display control unit further displays on a prescribed menu screen in which some of the operation items are aggregated. On the prescribed menu screen, when the vehicle is in motion, the operation item identified as having a high frequency of use when the vehicle is in motion is displayed, and when the vehicle is stopped, the operation item identified as having a high frequency of use when the vehicle is stopped is displayed.

Abstract: A storage apparatus according to an aspect of the present invention is configured to perform a deduplication process on write data from a host. For the deduplication process, the storage apparatus calculates a feature value of write data, and records, in a management region, metadata that is a set of the feature value of the write data and information on a storage position of the write data. However, to prevent the amount of metadata stored in the management region from increasing, if write data meets a predetermined condition, the storage apparatus does not perform the deduplication process, and suppresses creation of metadata of the write data.

Abstract: A storage apparatus according to an aspect of the present invention is configured to perform a deduplication process on write data from a host. For the deduplication process, the storage apparatus calculates a feature value of write data, and records, in a management region, metadata that is a set of the feature value of the write data and information on a storage position of the write data. However, to prevent the amount of metadata stored in the management region from increasing, if write data meets a predetermined condition, the storage apparatus does not perform the deduplication process, and suppresses creation of metadata of the write data.

Abstract: According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.

Abstract: According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.

Abstract: According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.

Abstract: According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

Abstract: A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

Abstract: A light-emitting module includes a substrate, a wiring pattern, and a light-emitting device that generates heat. The substrate includes a metal base and an insulating base that is stacked on the metal base and has a mount surface on the opposite side of the metal base. The insulating base has a plurality of insulating layers stacked on one another. The wiring pattern is provided on the mount surface of the substrate. The light-emitting device is mounted on the mount surface of the substrate and is electrically connected to the wiring pattern.

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a plurality of light-emitting elements, and pressure member. The substrate includes a first surface in contact with a thermally radiative member, a second surface positioned in a side opposite to the first surface, and an outer circumferential surface which bridges outer circumferential edges of the first surface and the second surface. The light-emitting elements are mounted on the second surface of the substrate. The pressure member elastically press the substrate toward the thermally radiative member. A gap is provided between the pressure member and the outer circumferential surface of the substrate.

Abstract: The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.

Abstract: According to one embodiment, a light-emitting apparatus includes a substrate, an attachment member, and a mechanical fixing component. The substrate has light-emitting elements mounted on one surface side thereof. The attachment member includes a concave portion in which the substrate is arranged with a gap between the substrate and a side circumference of the concave portion. The mechanical fixing component includes a pressure portion that is in contact with the one surface side of the substrate, the mechanical fixing component being configured to hold the substrate in the concave portion of the attachment member by elastic pressing force of the pressure portion acting in a direction from the one surface side toward the other surface side of the substrate.

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a first wiring pattern provided on the module substrate and including a common wire connecting portion, a second wiring pattern provided on the module substrate and including a first wire connecting portion, a second wire connecting portion, and a middle pattern portion, a first light-emitting element group arranged between the common wire connecting portion and the first wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the first wire connecting portion, and a second light-emitting element group arranged between the common wire connecting portion and the second wire connecting portion and including semiconductor light-emitting elements connected in series and being electrically connected to the common wire connecting portion and the second wire connecting portion.

Abstract: According to one embodiment, a light emitting device includes: a substrate a back face side of which is disposed on a mounting member; a plurality of light emitting elements mounted on a surface side of the substrate; and a power supply terminal provided on the surface side of the substrate and electrically connected to the light emitting elements. The power supply terminal is connected to electrical connecting units by elastic pressing force directed from the surface side of the substrate to the mounting member side. A mechanical fixing unit has a pressing portion brought into contact with the surface side of the substrate. The mechanical fixing units fix the substrate to the mounting member with use of elastic pressing force of the pressing portions directed from the surface side of the substrate to the mounting member side.

Abstract: According to one embodiment, a light emitting device includes a substrate, a light emitting element and connectors. The substrate has a surface and a back face, and power supply terminals are formed on the surface. The light emitting element is mounted on the surface of the substrate. The connector includes a contact portion coming into contact with, the power supply terminal on the surface side of the substrate and a connector terminal having a wire connection portion projecting on the back face side of the substrate, and a power supply wire is connected to the wire connection portion of the connector terminal.

Abstract: A lighting device includes a printed wiring board, a plurality of light-emitting elements, a sealing member, and a color conversion unit, and an adhesive layer. The sealing member has light transmitting properties and seals the light-emitting elements mounted on the printed wiring board. The color conversion unit includes a cover member of light transmitting properties, and a fluorescent substance layer provided on the inner surface of the cover member. The adhesive layer has light-transmitting properties, and adheres the sealing member to the fluorescent substance layer of the color conversion unit in an airtight manner.

Abstract: According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a plurality of light-emitting elements, and pressure member. The substrate includes a first surface in contact with a thermally radiative member, a second surface positioned in a side opposite to the first surface, and an outer circumferential surface which bridges outer circumferential edges of the first surface and the second surface. The light-emitting elements are mounted on the second surface of the substrate. The pressure member elastically press the substrate toward the thermally radiative member. A gap is provided between the pressure member and the outer circumferential surface of the substrate.

Abstract: A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.