Patents by Inventor Haruko Harada
Haruko Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12233465Abstract: A cutting tool is a cutting tool including: a base; and a coating disposed on the base, wherein the coating includes a first layer, wherein the first layer is composed of ?-Al2O3, a thickness of the first layer is 2 ?m or more and 15 ?m or less, on a cross section along a normal line of an interface between the base and the coating, a ratio N2/N1 is 0.60 or more, and on the cross section along the normal line of the interface between the base and the coating, a ratio N4/N3 and the ratio N2/N1 satisfy a relationship of a Formula 1.Type: GrantFiled: January 23, 2024Date of Patent: February 25, 2025Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Haruko Harada, Fumiyoshi Kobayashi, Anongsack Paseuth, Kosuke Tominaga
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Patent number: 12220749Abstract: A cutting tool comprising a base material and a coating disposed on the base material, wherein the coating comprises a hard particle layer, the hard particle layer is formed from a plurality of hard particles consisting of titanium, silicon, carbon, and nitrogen, the hard particle layer comprises a first region and a second region, a composition of the first region is Ti(1-Xb)SiXbCN, a composition of the second region is Ti(1-Xs)SiXsCN, the Xs and the Xb satisfy relationships of Xb?Xs?0.01 and 0<Xs<Xb?0.10, the hard particles have a cubic crystal structure, and in the hard particles, a concentration of the silicon changes periodically along a first direction going from the first main surface to the second main surface.Type: GrantFiled: July 13, 2023Date of Patent: February 11, 2025Assignee: Sumitomo Electric Industries, Ltd.Inventors: Fumiyoshi Kobayashi, Anongsack Paseuth, Haruko Harada
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Publication number: 20250018477Abstract: A cutting tool comprising a base material and a coating disposed on the base material, wherein the coating comprises a hard particle layer, the hard particle layer is formed from a plurality of hard particles consisting of titanium, silicon, carbon, and nitrogen, the hard particle layer comprises a first region and a second region, a composition of the first region is Ti(1-Xb)SiXbCN, a composition of the second region is Ti(1-Xs)SiXsCN, the Xs and the Xb satisfy relationships of Xb?Xs?0.01 and 0<Xs<Xb?0.10, the hard particles have a cubic crystal structure, and in the hard particles, a concentration of the silicon changes periodically along a first direction going from the first main surface to the second main surface.Type: ApplicationFiled: July 13, 2023Publication date: January 16, 2025Applicant: Sumitomo Electric Industries, Ltd.Inventors: Fumiyoshi KOBAYASHI, Anongsack PASEUTH, Haruko HARADA
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Patent number: 12109629Abstract: A cutting tool comprising a base material and a coating disposed on the base material, wherein the coating comprises a hard particle layer, the hard particle layer is formed from a plurality of hard particles consisting of titanium, silicon, carbon, and nitrogen, the hard particle layer comprises a first region and a second region, a composition of the first region is Ti(1-Xb)SiXbCN, a composition of the second region is Ti(1-Xs)SiXsCN, the Xs and the Xb satisfy relationships of Xs-Xb?0.01 and 0<Xb<Xs?0.10, the hard particles have a cubic crystal structure, and in the hard particles, a concentration of the silicon changes periodically along a first direction going from the first main surface to the second main surface.Type: GrantFiled: July 13, 2023Date of Patent: October 8, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Fumiyoshi Kobayashi, Anongsack Paseuth, Haruko Harada
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Patent number: 11975391Abstract: A cutting tool including a substrate and a coating film disposed on the substrate, wherein the cutting tool includes: a rake face, a flank face contiguous to the rake face; and a cutting edge region composed of a boundary part between the rake face and the flank face, wherein the coating film includes a TiSiCN layer, the TiSiCN layer has: a first TiSiCN layer positioned in the rake face; and a second TiSiCN layer positioned in the cutting edge region, the first TiSiCN layer has a composition of Ti(1-Xr)SiXrCN, the second TiSiCN layer has a composition of Ti(1-Xe)SiXeCN, and the Xr and the Xe each represent 0.010 or more and 0.100 or less, and satisfy a relationship of Xr?Xe?0.003.Type: GrantFiled: August 30, 2022Date of Patent: May 7, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Fumiyoshi Kobayashi, Anongsack Paseuth, Haruko Harada
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Publication number: 20240066605Abstract: A cutting tool including a substrate and a coating film disposed on the substrate, wherein the cutting tool includes: a rake face, a flank face contiguous to the rake face; and a cutting edge region composed of a boundary part between the rake face and the flank face, wherein the coating film includes a TiSiCN layer, the TiSiCN layer has: a first TiSiCN layer positioned in the rake face; and a second TiSiCN layer positioned in the cutting edge region, the first TiSiCN layer has a composition of Ti(1-Xr)SiXrCN, the second TiSiCN layer has a composition of Ti(1-Xe)SiXeCN, and the Xr and the Xe each represent 0.010 or more and 0.100 or less, and satisfy a relationship of Xr?Xe?0.003.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Applicant: Sumitomo Electric Industries, Ltd.Inventors: Fumiyoshi KOBAYASHI, Anongsack PASEUTH, Haruko HARADA
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Patent number: 11813677Abstract: A cutting tool including a substrate and a coating film disposed on the substrate, wherein the cutting tool includes: a rake face; a flank face contiguous to the rake face; and a cutting edge region composed of a boundary part between the rake face and the flank face, wherein the coating film includes a TiSiCN layer, the TiSiCN layer has: a first TiSiCN layer positioned in the rake face; and a second TiSiCN layer positioned in the cutting edge region, the first TiSiCN layer has a composition of Ti(1-Xr)SiXrCN, the second TiSiCN layer has a composition of Ti(1-Xe)SiXeCN, and the Xr and the Xe each represent 0.010 or more and 0.100 or less, and satisfy a relationship of Xe-Xr?0.003.Type: GrantFiled: August 30, 2022Date of Patent: November 14, 2023Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Fumiyoshi Kobayashi, Anongsack Paseuth, Haruko Harada
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Patent number: 11786975Abstract: A cutting tool includes a substrate and a coating film, wherein the coating film has a first layer formed from a plurality of hard grains, the hard grains are made of TiSiCN having a cubic crystal structure, the hard grains have a lamellar structure in which a layer having a relatively high silicon concentration and a layer having a relatively low silicon concentration are alternately stacked, and a maximum value of percentage of number ASi of silicon atoms to a sum of the number ASi of silicon atoms and number ATi of titanium atoms in a grain boundary region between the hard grains, {ASi/(ASi+ATi)}×100, is larger than an average value of percentage of number BSi of silicon atoms to a sum of the number BSi of silicon atoms and number BTi of titanium atoms in the first layer, {BSi/(BSi+BTi)}×100.Type: GrantFiled: January 25, 2022Date of Patent: October 17, 2023Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Haruko Harada, Satoshi Ono, Anongsack Paseuth, Katsumi Okamura
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Publication number: 20230234141Abstract: A cutting tool includes a substrate and a coating film, wherein the coating film has a first layer formed from a plurality of hard grains, the hard grains are made of TiSiCN having a cubic crystal structure, the hard grains have a lamellar structure in which a layer having a relatively high silicon concentration and a layer having a relatively low silicon concentration are alternately stacked, and a maximum value of percentage of number ASi of silicon atoms to a sum of the number ASi of silicon atoms and number ATi of titanium atoms in a grain boundary region between the hard grains, {ASi/(ASi+ATi)}×100, is larger than an average value of percentage of number BSi of silicon atoms to a sum of the number BSi of silicon atoms and number BTi of titanium atoms in the first layer, {BSi/(BSi+BTi)}×100.Type: ApplicationFiled: January 25, 2022Publication date: July 27, 2023Applicant: Sumitomo Electric Industries, Ltd.Inventors: Haruko HARADA, Satoshi ONO, Anongsack PASEUTH, Katsumi OKAMURA
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Patent number: 5861411Abstract: A novel 4-acylaminopyridine derivative represented by the following formula (I) is disclosed. ##STR1## The 4-acylaminopyridine derivative of the present invention is useful as a medicine for treating disturbances of memory such as senile dementia and Alzheimer's disease, since it has an action of directly activating malfunctioned cholinergic neuron.Type: GrantFiled: April 10, 1996Date of Patent: January 19, 1999Assignee: Mitsubishi Chemical CorporationInventors: Kunihiro Ninomiya, deceased, Ken-ichi Saito, Mamoru Sugano, Akihiro Tobe, Yasuhiro Morinaka, Tomoko Bessho, Haruko Harada
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Patent number: 5536728Abstract: A novel 4-acylaminopyridine derivative represented by the following formula (I) is disclosed. ##STR1## The 4-acylaminopyridine derivative of the present invention is useful as a medicine for treating disturbances of memory such as senile dementia and Alzheimer's disease, since it has an action of directly activating malfunctioned cholinergic neuron.Type: GrantFiled: December 8, 1994Date of Patent: July 16, 1996Assignee: Mitsubishi Chemical CorporationInventors: Kunihiro Ninomiya, deceased, Ken-ichi Saito, Mamoru Sugano, Akihiro Tobe, Yasuhiro Morinaka, Tomoko Bessho, Haruko Harada
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Patent number: 5397785Abstract: A novel 4-acylaminopyridine derivative represented by the following formula (I) is disclosed. ##STR1## The 4-acylaminopyridine derivative of the present invention is useful as a medicine for treating disturbances of memory such as senile dementia and Alzheimer's disease, since it has an action of directly activating malfunctioned cholinergic neuron.Type: GrantFiled: September 2, 1993Date of Patent: March 14, 1995Assignee: Mitsubishi Kasei CorporationInventors: Kunihiro Ninomiya, deceased, Ken-ichi Sato, Mamoru Sugano, Akihiro Tobe, Yasuhiro Morinaka, Tomoko Bessho, Haruko Harada