Abstract: A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G?1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G?2) of a cured pro duct obtained by curing the composition, the increase rate (?) of the storage elastic modulus is at least 50%.

Abstract: Provided is a curable organopolysiloxane composition having: high thermal conductivity, excellent deep curability under room temperature, excellent adhesion to various base materials, and excellent tight fitting properties to heat dissipating components and the like; a thermally conductive member containing the same; and a heat dissipating structure using the same. A multicomponent curable organopolysiloxane composition comprises: a diorganopolysiloxane with a molecular terminal blocked by a hydroxysilyl group; (B) a diorganopolysiloxane with a molecular terminal blocked by an alkoxysilyl group; (C) a thermally conductive filler; (D) an organic silicon compound serving as a surface treating agent of component (C); (E) a component selected from alkylalkoxysilanes and specific adhesion-imparting agents; and (F) a catalytic amount of a condensation-reaction catalyst.

Abstract: A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 ?m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 ?m, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.

Abstract: A room temperature curable organopolysiloxane composition for protecting electric/electronic parts is disclosed. The composition comprises: (A) an organopolysiloxane having a viscosity at 25° C. of 20 to 1,000,000 mPa·s and having at least two silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups in a molecule; (B) an alkoxysilane represented by the following general formula or a partial hydrolysis condensation product thereof: R1aSi(OR2)(4-a) wherein R1 is a monovalent hydrocarbon group having a carbon number of 1 to 12, R2 is an alkyl group having a carbon number of 1 to 3, and subscript “a” is an integer of 0 to 2; (C) a mercaptobenzothiazole based compound; (D) zinc oxide powder and/or zinc carbonate powder; and (E) a catalyst for condensation reactions. The composition and/or a cured product thereof can protect electric/electronic parts from corrosive gases such as hydrogen sulfide gas and sulfuric acid contained in the atmosphere.

Abstract: A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G?1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G?2) of a cured pro duct obtained by curing the composition, the increase rate (?) of the storage elastic modulus is at least 50%.

Abstract: A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 ?m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 ?m, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.

Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.

Abstract: A room temperature curable organopolysiloxane composition for protecting electric/electronic parts is disclosed. The composition comprises: (A) an organopolysiloxane having a viscosity at 25° C. of 20 to 1,000,000 mPa·s and having at least two silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups in a molecule; (B) an alkoxysilane represented by the following general formula or a partial hydrolysis condensation product thereof: R1aSi(OR2)(4-a) wherein R1 is a monovalent hydrocarbon group having a carbon number of 1 to 12, R2 is an alkyl group having a carbon number of 1 to 3, and subscript “a” is an integer of 0 to 2; (C) a mercaptobenzothiazole based compound; (D) zinc oxide powder and/or zinc carbonate powder; and (E) a catalyst for condensation reactions. The composition and/or a cured product thereof can protect electric/electronic parts from corrosive gases such as hydrogen sulfide gas and sulfuric acid contained in the atmosphere.

Abstract: Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Abstract: A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.

Abstract: A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.

Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Abstract: Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.

Abstract: A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.

Abstract: A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.

Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.

Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a re-inforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.

Abstract: A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.