Abstract: A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (ii) a structure derived from 3,3?4,4?-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (iii) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 2,2?-dimethyl-4,4?-diaminobiphenyl.

Abstract: A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (ii) a structure derived from 3,3?4,4?-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (iii) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 2,2?-dimethyl-4,4?-diaminobiphenyl.

Abstract: A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (ii) a structure derived from 3,3?4,4?-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4?-diaminodiphenyl ether; or (iii) a structure derived from 4,4?-oxydiphthalic acid dianhydride and a structure derived from 2,2?-dimethyl-4,4?-diaminobiphenyl.

Abstract: A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of R1 to R4 independently represents a hydrogen atom or a monovalent organic group).

Abstract: A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of R1 to R4 independently represents a hydrogen atom or a monovalent organic group).

Abstract: Provided are: a polyacrylonitrile-based precursor fiber for the production of a carbon fiber having a large single-fiber fineness, said precursor fiber ensuring high heat stability of a spinning dope and excellent productivity; and a copolymer suitable for the production of said precursor fiber. Also provided are: high-quality carbon fiber bundles which have a large single-fiber fineness and excellent productivity; a process for producing the same; and a process for producing flameproofed fiber bundles suitable for the production of the carbon fiber bundles. A polyacrylonitrile-based copolymer which comprises 93.0 to 99.4 mol % of acrylonitrile units, 0.5 to 4.0 mol % of (meth)acrylamide-based units, and 0.1 to 3.

Abstract: Provided are: a polyacrylonitrile-based precursor fiber for the production of a carbon fiber having a large single-fiber fineness, said precursor fiber ensuring high heat stability of a spinning dope and excellent productivity; and a copolymer suitable for the production of said precursor fiber. Also provided are: high-quality carbon fiber bundles which have a large single-fiber fineness and excellent productivity; a process for producing the same; and a process for producing flameproofed fiber bundles suitable for the production of the carbon fiber bundles. A polyacrylonitrile-based copolymer which comprises 93.0 to 99.4 mol % of acrylonitrile units, 0.5 to 4.0 mol % of (meth)acrylamide-based units, and 0.1 to 3.

Abstract: The present invention relates to a photosensitive alkali-soluble silicone resin composition comprising an alkali-soluble silicone resin (A) which comprises a carboxyl group or a dicarboxylic acid anhydride group in one molecule; an alkali-soluble resin (B) whose acid value is between 10 mgKOH/g and 200 mgKOH/g; and a photoinitiator (C). The (A) or (B) ingredient may comprise a photosensitive unsaturated double bond group, or the photosensitive alkali-soluble silicone resin composition may further comprise a compound (D) which comprises a photosensitive unsaturated double bond.

Abstract: Provided are: a carbon fiber bundle which has a large value of single-fiber fineness and excellent productivity and which, despite this, contains few interlaced single fibers therein and has excellent spreadability; and precursor fibers which are suitable for use in producing the carbon fiber bundle. The precursor fibers are a carbon-fiber-precursor acrylic fiber bundle which comprises a polyacrylonitrile copolymer comprising 95-99 mol % acrylonitrile units and 1-5 mol % hydroxyalkyl (meth)acrylate units and which has a single-fiber fineness of 1.5-5.0 dtex. In the acrylic fiber bundle, the cross-section of each single fiber which is perpendicular to the fiber axis has a shape that has a roundness of 0.9 or less.