Abstract: A method of preparing a surface-mounted wiring board according to the present invention includes forming a plurality of die pads and bonding pads, which are composed of Cu or Ni and arranged at predetermined areas of a wiring board. Electrical connections are formed between the die pads and between the die pad and the bonding pads. An Au-plated coating on each of the formed pad surfaces is formed by electroplating. The Au-electroplated pad surfaces are isolated from each other by selectively cutting away part of a predetermined area on the wiring board to separate the conductors electrically interconnecting the pads.When both the die pad for arranging and mounting an electronic component and the bonding pads for connecting the arranged and mounted electronic component to the signal lines (wiring pattern) are Au-electroplated to coat them, one conductor terminal for plating is shared among the die pad and the bonding pads.