Abstract: Peripheral surfaces of holes formed are fixed in place and processed sheet is obtained in a state where the hole pattern is formed accurately. The apparatus is provided with a die on a surface of which are formed projecting parts corresponding to a hole pattern to be added to a processed sheet, an ultrasonic horn provided facing the die and outputting an ultrasonic wave toward a surface of the die, and a conveyor mechanism superposing over the processed sheet a resin sheet for melt bonding with and recovering pieces of the processed sheet punched out from the holes, passing the sheets between the die and the ultrasonic horn, and separating the resin sheet and the processed sheet after passage.

Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A method of detachment of a connector which is provided with a housing having connector pins to be inserted into a board and with a first member which is arranged between the housing and the board and through which the connector pins are inserted, the method including a process of pulling out the connector pins from the board. This process utilizes the lever principle, which uses the first member as a fulcrum and which uses any point on the housing as a point of action, so as to pull out the connector pins from the board.

Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

Abstract: A twin wire splitter system comprises an X-Y table for mounting a printed circuit board thereon; a wire bonding device for continuously bonding a twin wire to a plurality of wire connecting positions on the printed circuit board; a feeding device for feeding the twin wire; a splitting device provided on a twin wire feeding path to split the twin wire; and a splitting operation controlling device for controlling the start and end of the twin wire splitting operation carried out by the splitting means, according to the length along the twin wire feeding path between the bonding position of the wire bonding device and the splitting position of the splitting device, the length of a portion of the twin wire to be split, and the feed length of the twin wire for each sucessive bonding operation corresponding to the connecting sequence of positions to be interconnected by the twin wire on the printed circuit board.