Patents by Inventor Haruna SUZUKI

Haruna SUZUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162480
    Abstract: A solid electrolyte material has a pair of surfaces which face each other and includes at least one of a predetermined halide-based solid electrolyte or a predetermined sulfide-based solid electrolyte, in which a surface ten-point average roughness RzJIS of at least one of the pair of surfaces falls in the range from 20 nm or more and 1500 nm or less.
    Type: Application
    Filed: March 28, 2022
    Publication date: May 16, 2024
    Applicant: TDK CORPORATION
    Inventors: Haruna KATO, Hisashi SUZUKI, Tetsuya UENO, Chieko SHIMIZU
  • Patent number: 11764070
    Abstract: An etching method includes: providing, in a chamber, a substrate including a structure including a first film selected from a molybdenum film and a tungsten film; performing a first etching on the first film by supplying an oxidation gas and a first gas selected from a MoF6 gas and a WF6 gas into the chamber; when a pore present inside the first film is exposed by the first etching, filling the pore with one of molybdenum and tungsten by stopping the first etching and supplying a reduction gas and a second gas selected the MoF6 gas and the WF6 gas into the chamber; and performing a second etching on a filling layer formed in the filling and the first film by supplying the oxidation gas and a third gas selected from the MoF6 gas and the WF6 gas into the chamber.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: September 19, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Satoshi Toda, Naoki Shindo, Haruna Suzuki, Gen You
  • Publication number: 20230014819
    Abstract: An etching method includes: providing, within a chamber, a substrate that includes at least a silicon-containing material and a molybdenum film or a tungsten film which is in an exposed state, and selectively etching the molybdenum film or the tungsten film relative to the silicon-containing material by supplying, into the chamber, an oxidation gas and a hexafluoride gas as an etching gas.
    Type: Application
    Filed: October 28, 2020
    Publication date: January 19, 2023
    Inventors: Satoshi TODA, Naoki SHINDO, Mitsuhiro TACHIBANA, Haruna SUZUKI, Gen YOU
  • Patent number: 11523977
    Abstract: A multi-agent type hair treatment agent comprising a first composition containing component (A) and component (B); and a second composition containing component (C), wherein the weight ratio (H)/(C) of component (H) to component (C) in the second composition is less than 1. A hair treatment method comprising the steps of applying and rinsing the first composition to hair (i) and then applying the second composition to hair (ii). Component (A): a carboxylic acid having an inorganic value of 230 or more and 450 or less and an organic value of 50 or more and 250 or less, or a salt of the carboxylic acid Component (B): anionic surfactant Component (C): an aromatic sulfonic acid having a molecular weight of 300 or less or a salt thereof Component (H): cationic surfactant.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: December 13, 2022
    Assignee: KAO CORPORATION
    Inventors: Azusa Nishimura, Haruna Suzuki, Shinobu Nagase
  • Publication number: 20220384178
    Abstract: An etching method includes preparing a substrate in which titanium nitride and molybdenum or tungsten are present, and etching the titanium nitride by supplying a processing gas including a ClF3 gas and a N2 gas to the substrate, wherein in the etching the titanium nitride, a partial pressure ratio of the ClF3 gas to the N2 gas in the processing gas is set to a value at which grain boundaries of the molybdenum or the tungsten are nitrided to such an extent that generation of a pitting is suppressed.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Inventors: Naoki SHINDO, Gen YOU, Haruna SUZUKI
  • Publication number: 20220020601
    Abstract: An etching method includes: providing, in a chamber, a substrate including a structure including a first film selected from a molybdenum film and a tungsten film; performing a first etching on the first film by supplying an oxidation gas and a first gas selected from a MoF6 gas and a WF6 gas into the chamber; when a pore present inside the first film is exposed by the first etching, filling the pore with one of molybdenum and tungsten by stopping the first etching and supplying a reduction gas and a second gas selected the MoF6 gas and the WF6 gas into the chamber; and performing a second etching on a filling layer formed in the filling and the first film by supplying the oxidation gas and a third gas selected from the MoF6 gas and the WF6 gas into the chamber.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Inventors: Satoshi TODA, Naoki SHINDO, Haruna SUZUKI, Gen YOU
  • Publication number: 20210154111
    Abstract: A multi-agent type hair treatment agent comprising a first composition containing component (A) and component (B); and a second composition containing component (C), wherein the weight ratio (H)/(C) of component (H) to component (C) in the second composition is less than 1. A hair treatment method comprising the steps of applying and rinsing the first composition to hair (i) and then applying the second composition to hair (ii).
    Type: Application
    Filed: May 14, 2018
    Publication date: May 27, 2021
    Applicant: KAO CORPORATION
    Inventors: Azusa NISHIMURA, Haruna SUZUKI, Shinobu NAGASE