Patents by Inventor Haruna TADA
Haruna TADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240074122Abstract: A power semiconductor device includes a power module unit and a heat sink. An uneven portion is formed in a module base in the power module unit. The uneven portion includes a depression portion and a buffer depression portion. An uneven portion is formed in a heat sink base unit in the heat sink. The uneven portion and the uneven portion are fitted together by crimping so that the module base of the power module unit and a heat dissipation spreader of the heat sink are integrated. The buffer depression portion is left as a space.Type: ApplicationFiled: January 14, 2022Publication date: February 29, 2024Applicant: Mitsubishi Electric CorporationInventors: Yasuyuki SANDA, Masaki GOTO, Hayato TERADA, Hodaka ROKUBUICHI, Haruna TADA
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Patent number: 11152280Abstract: A semiconductor device includes a power module unit, a fin base, and a plurality of radiator fins. The power module unit and the fin base are integrated together, with a recess-projection portion formed on the power module unit being fitted to a recess-projection portion formed on the fin base. The plurality of radiator fins are integrally fitted on a heat radiation diffusion portion of the fin base.Type: GrantFiled: November 16, 2017Date of Patent: October 19, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuyuki Sanda, Dai Nakajima, Haruna Tada, Hodaka Rokubuichi, Kiyofumi Kitai
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Patent number: 11107745Abstract: A semiconductor device includes a power module unit, a fin base, and a plurality of radiator fins. The power module unit and the fin base are integrated together, with a recess-projection portion formed on the power module unit being fitted to a recess-projection portion formed on the fin base. The plurality of radiator fins are integrally fitted on a heat radiation diffusion portion of the fin base.Type: GrantFiled: November 16, 2017Date of Patent: August 31, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuyuki Sanda, Dai Nakajima, Haruna Tada, Hodaka Rokubuichi, Kiyofumi Kitai
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Patent number: 11049787Abstract: A metal component and a heat dissipation member are integrated with each other in a plurality of protrusion-recess portions where the plurality of recess portions and the plurality of protrusion portions contact each other. A first protrusion-recess portion as a part of the plurality of protrusion-recess portions is greater in height direction dimension than a second protrusion-recess portion other than the first protrusion-recess portion among the plurality of protrusion-recess portions. A wall surface of the first protrusion-recess portion includes a first wall surface portion having a first inclination angle to a height direction, and a second wall surface portion having a second inclination angle different from the first inclination angle.Type: GrantFiled: October 19, 2017Date of Patent: June 29, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Haruna Tada, Dai Nakajima, Yasuyuki Sanda
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Patent number: 10775329Abstract: A thermal conductivity measurement device comprises: first and second clamping members which clamp an object; a heating member which has a contacting end surface which contacts a distal end surface of the first clamping member through a first axial correction member, and a distal end surface on the reverse side of the contacting end surface; a cooling member which has a contacting end surface which contacts a distal end surface of the second clamping member through a second axial correction member, and a distal end surface on the reverse side of the contacting end surface; a plurality of temperature sensors disposed on the clamping members; and a mechanism which applies a pressing force between the heating member and the cooling member. At least one surface of the first axial correction member and the second axial correction member has a convex curved shape, and the other surface is a flat surface.Type: GrantFiled: December 27, 2017Date of Patent: September 15, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Haruna Tada, Yasuyuki Sanda, Dai Nakajima
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Patent number: 10768127Abstract: This thermal conductivity measurement apparatus has a first holding member which has an end face that contacts an object to be measured and a distal end face; a second holding member which has an end face that contacts an object to be measured and a distal end face; a heating member which has an end face which abuts the distal end face of the first holding member and a distal end face, and which heats the first holding member; a cooling member which has an end face that abuts the distal end face of the second holding member and a distal end face, and which cools the second holding member; a plurality of temperature sensors provided at the first and the second holding members; and a pressing force application mechanism that applies pressing force to the first holding member, the second holding member, and the object to be measured.Type: GrantFiled: October 21, 2016Date of Patent: September 8, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuyuki Sanda, Dai Nakajima, Haruna Tada
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Publication number: 20200043824Abstract: A metal component and a heat dissipation member are integrated with each other in a plurality of protrusion-recess portions where the plurality of recess portions and the plurality of protrusion portions contact each other. A first protrusion-recess portion as a part of the plurality of protrusion-recess portions is greater in height direction dimension than a second protrusion-recess portion other than the first protrusion-recess portion among the plurality of protrusion-recess portions. A wall surface of the first protrusion-recess portion includes a first wall surface portion having a first inclination angle to a height direction, and a second wall surface portion having a second inclination angle different from the first inclination angle.Type: ApplicationFiled: October 19, 2017Publication date: February 6, 2020Applicant: Mitsubishi Electric CorporationInventors: Haruna TADA, Dai NAKAJIMA, Yasuyuki SANDA
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Publication number: 20190369038Abstract: A thermal conductivity measurement device comprises: first and second clamping members which clamp an object; a heating member which has a contacting end surface which contacts a distal end surface of the first clamping member through a first axial correction member, and a distal end surface on the reverse side of the contacting end surface; a cooling member which has a contacting end surface which contacts a distal end surface of the second clamping member through a second axial correction member, and a distal end surface on the reverse side of the contacting end surface; a plurality of temperature sensors disposed on the clamping members; and a mechanism which applies a pressing force between the heating member and the cooling member. At least one surface of the first axial correction member and the second axial correction member has a convex curved shape, and the other surface is a flat surface.Type: ApplicationFiled: December 27, 2017Publication date: December 5, 2019Applicant: Mitsubishi Electric CorporationInventors: Haruna Tada, Yasuyuki Sanda, Dai Nakajima
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Publication number: 20190295919Abstract: A semiconductor device includes a power module unit, a fin base, and a plurality of radiator fins. The power module unit and the fin base are integrated together, with a recess-projection portion formed on the power module unit being fitted to a recess-projection portion formed on the fin base. The plurality of radiator fins are integrally fitted on a heat radiation diffusion portion of the fin base.Type: ApplicationFiled: November 16, 2017Publication date: September 26, 2019Applicant: Mitsubishi Electric CorporationInventors: Yasuyuki Sanda, Dai Nakajima, Haruna Tada, Hodaka Rokubuichi, Kiyofumi Kitai
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Publication number: 20180299391Abstract: This thermal conductivity measurement apparatus has a first holding member which has an end face that contacts an object to be measured and a distal end face; a second holding member which has an end face that contacts an object to be measured and a distal end face; a heating member which has an end face which abuts the distal end face of the first holding member and a distal end face, and which heats the first holding member; a cooling member which has an end face that abuts the distal end face of the second holding member and a distal end face, and which cools the second holding member; a plurality of temperature sensors provided at the first and the second holding members; and a pressing force application mechanism that applies pressing force to the first holding member, the second holding member, and the object to be measured.Type: ApplicationFiled: October 21, 2016Publication date: October 18, 2018Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuyuki SANDA, Dai NAKAJIMA, Haruna TADA