Patents by Inventor Haruna Yamazaki
Haruna Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11521302Abstract: An image processing apparatus that operates in a plurality of modes including a first mode for performing high image quality processing of image data and a second mode for performing high-speed processing of image data, performs the following processing. More specifically, the apparatus performs, in accordance with the mode to be operated, the settings of each of an operation to output image data from a first DMAC (Direct Memory Access Controller) to a common bus, an operation to input the image data from the common bus to an image processing unit, an operation of the image processing unit, an operation to output the image data from the image processing unit to the common bus, and an operation to output the image data from the common bus to a second DMAC.Type: GrantFiled: June 30, 2020Date of Patent: December 6, 2022Assignee: CANON KABUSHIKI KAISHAInventors: Akihiro Yoshitani, Haruna Yamazaki, Tomoki Kobayashi
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Publication number: 20210012469Abstract: An image processing apparatus that operates in a plurality of modes including a first mode for performing high image quality processing of image data and a second mode for performing high-speed processing of image data, performs the following processing. More specifically, the apparatus performs, in accordance with the mode to be operated, the settings of each of an operation to output image data from a first DMAC (Direct Memory Access Controller) to a common bus, an operation to input the image data from the common bus to an image processing unit, an operation of the image processing unit, an operation to output the image data from the image processing unit to the common bus, and an operation to output the image data from the common bus to a second DMAC.Type: ApplicationFiled: June 30, 2020Publication date: January 14, 2021Inventors: Akihiro Yoshitani, Haruna Yamazaki, Tomoki Kobayashi
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Patent number: 10604653Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.Type: GrantFiled: October 12, 2016Date of Patent: March 31, 2020Assignee: Dow Toray Co., Ltd.Inventors: Ryota Dogen, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
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Publication number: 20200048463Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.Type: ApplicationFiled: October 12, 2016Publication date: February 13, 2020Inventors: Ryota DOGEN, Haruna YAMAZAKI, Shin YOSHIDA, Makoto YOSHITAKE
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REACTIVE HOT-MELT SILICONE FILLING CONTAINER AND METHOD FOR MANUFACTURING REACTIVE HOT-MELT SILICONE
Publication number: 20190276684Abstract: A reactive hot-melt silicone filling container is disclosed. The reactive hot-melt silicone filling container includes a crosslinkable silicone composition. The crosslinkable silicone composition comprises: (A) an alkenyl group-bonded organopolysiloxane including at least a branched organopolysiloxane having an alkenyl group and a softening point of 50° C. or higher; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a hydrosilylation reaction catalyst. The crosslinkable silicone composition is filled into a container and the container is heated so as to crosslink the crosslinkable silicone composition in the B-stage state, to form reactive hot-melt silicone that is non-fluid at 25° C. and has a melt viscosity of 5,000 Pa·s or lower at 120° C. The reactive hot-melt silicone filling container can provide reactive hot-melt silicone having excellent gap filling properties upon heating.Type: ApplicationFiled: October 23, 2017Publication date: September 12, 2019Inventors: Haruna YAMAZAKI, Ryoto SHIMA -
Patent number: 10208164Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.Type: GrantFiled: August 26, 2015Date of Patent: February 19, 2019Assignee: Dow Corning Toray Co., Ltd.Inventors: Ryota Dogen, Haruna Yamazaki, Makoto Yoshitake
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Patent number: 10167418Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.Type: GrantFiled: June 16, 2015Date of Patent: January 1, 2019Assignee: Dow Corning Co., Ltd.Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
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Publication number: 20180305547Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.Type: ApplicationFiled: October 12, 2016Publication date: October 25, 2018Inventors: Ryota DOGEN, Haruna YAMAZAKI, Shin YOSHIDA, Makoto YOSHITAKE
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Publication number: 20180208816Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.Type: ApplicationFiled: June 16, 2015Publication date: July 26, 2018Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
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Patent number: 9853193Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.Type: GrantFiled: June 4, 2015Date of Patent: December 26, 2017Assignees: Dow Corning Corporation, Dow Corning Toray Co., Ltd.Inventors: Masaaki Amako, Steven Swier, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
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Publication number: 20170253700Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.Type: ApplicationFiled: August 26, 2015Publication date: September 7, 2017Inventors: Ryota DOGEN, Haruna YAMAZAKI, Makoto YOSHITAKE
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Patent number: 9751988Abstract: This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.Type: GrantFiled: February 16, 2015Date of Patent: September 5, 2017Assignees: DOW CORNING TORAY CO., LTD., DOW CORNING CORPORATIONInventors: Gunn Jo, Haruna Yamazaki, Ju Young Yook, Makoto Yoshitake
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Publication number: 20170166701Abstract: This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.Type: ApplicationFiled: February 16, 2015Publication date: June 15, 2017Inventors: Gunn JO, Haruna YAMAZAKI, Ju Young YOOK, Makoto YOSHITAKE
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Publication number: 20170092822Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.Type: ApplicationFiled: June 4, 2015Publication date: March 30, 2017Inventors: Masaaki Amako, Steven Swier, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
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Patent number: 9536799Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.Type: GrantFiled: December 20, 2013Date of Patent: January 3, 2017Assignees: Dow Corning Corporation, Dow Corning Toray Co., Ltd.Inventors: Shin Yoshida, Makoto Yoshitake, Haruna Yamazaki, Masaaki Amako, Steven Swier, Toshiki Nakata
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Publication number: 20150315427Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.Type: ApplicationFiled: December 20, 2013Publication date: November 5, 2015Inventors: Shin Yoshida, Makoto Yoshitake, Haruna Yamazaki, Masaaki Amako, Steven Swier, Toshiki Nakata
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Publication number: 20150183960Abstract: The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product.Type: ApplicationFiled: June 18, 2013Publication date: July 2, 2015Applicant: Dow Corning Toray Co., Ltd.Inventors: Ryosuke Yamazaki, Haruna Yamazaki, Makoto Yoshitake