Abstract: A test probe assembly including a plurality of electrically conductive probe arms each of which is secured to a substrate and electrically coupled to one of electrically conductive lines provided on the substrate. An intermediate portion of the arm is arranged to be resiliently deformable when a probe point which extends therefrom comes into contact with a terminal of the electronic device under test. A guide is provided on the structure on which the arms are mounted, for guiding the probe point so that movement other than reciprocation is either prevented or arrested. The resilient portion is arranged with respect to the probe point so that generation of motion other than reciprocation of the probe point is attenuated.

Abstract: A plurality of probe wires are held by a probe supporter having a substantially rectangular cross-section. First, second and third side walls of the supporter, support the probe wires in a manner wherein they are arranged at predetermined intervals in an essentially parallel relationship with each other. The probe wires respectively extend from the first side wall to the second side wall by way of the third side wall. When testing an electronic-device, the third side wall faces a main surface of the device. The third side wall has a groove extending in a direction parallel with the main surface of at least one of the first and second sides wall. Each of the probe wires crosses the groove in a direction perpendicular to the direction along which the groove extends. The portions of the wires which cross the groove are pressed against the tested terminals.