Abstract: An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.

Abstract: A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher.

Abstract: There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere.

Abstract: Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Abstract: Reliability is improved by improving adhesiveness, crack resistance, and moisture resistance of a metal member-resin jointed body by enhancing adhesiveness between the metal member and the resin. A jointed body of a metal member and a resin including: an intermediate layer and a silane coupling agent layer formed on the metal member at an interface between the metal member and the resin, wherein the silane coupling agent layer and the resin are contacted; the intermediate layer is any one of an oxide layer of the metal, a chelating agent layer, a composite layer made of the oxide layer and the chelating agent layer, and a mixed layer made of the oxide and the chelating agent; and the intermediate layer has an electrically non-insulating characteristic, and a method of manufacturing the same.

Abstract: The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.

Abstract: A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher.

Abstract: A suspended particle device includes a first substrate; a second substrate; a first electrode that can be controlled for a potential; a second electrode that can be controlled for a potential different from that of the first electrode; an electrified body; and a liquid suspension containing charged light control particles and a dispersion medium, in which the first electrode, the second electrode and the electrified body are disposed between the first substrate and the second substrate, and the liquid suspension is sealed between the first substrate and the second substrate, and the light control particles are capable of being accumulated to a periphery of the electrified body. Thus, it is possible to ensure uniformity of transmission light as well as to hold a light transmittance state in a state where the power supply is stopped.

Abstract: A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher.

Abstract: An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.

Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1.

Abstract: A secondary battery capable of charging and discharging includes a positive electrode, a negative electrode, and an electrolytic solution, wherein the negative electrode permits aluminum to deposit thereon and the positive electrode permits lithium to be released therefrom at the time of discharging. The secondary battery excels conventional ones in output density and safety.

Abstract: The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween.

Abstract: Provided are an electrode, an electrolysis cell, and an electrochemical analyzer that improve the long-term stability of analysis data. A working electrode, a counter electrode, and reference electrode are disposed in an electrolysis cell. The working electrode is obtained by forming a lead wire in a composite material having platinum or a platinum alloy as a base material, in which a metal oxide is dispersed, or in a laminated material obtained by laminating a valve metal and platinum such that the cross sectional crystal texture in the thickness direction of the platinum is formed in layers and the thickness of each layer of the platinum is 5 micrometers or less. The metal oxide is selected from among zirconium oxide, tantalum oxide, and niobium oxide, and the metal oxide content of the platinum or the platinum alloy is 0.005 to 1 wt % in terms of the zirconium, tantalum, or niobium metal.

Abstract: Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.

Abstract: The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.

Abstract: The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

Abstract: In a method of manufacturing a printed wiring board, a via reaches from a surface copper layer to an inner-layer copper layer of a multilayer board, and copper layers and insulating layers are alternately layered. The wiring board is machined by a laser, and a process of machining the via includes forming a laser absorbing layer on a surface of a copper layer disposed on the surface of the multilayer board. The laser is irradiated, and an electrolytic etching and removal of the laser absorbing layer is carried out in this order.

Abstract: Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.

Abstract: A discrete track medium and a patterned medium that are excellent in both magnetic recording properties and corrosion resistance are realized. The medium has a magnetic recording layer, which includes a magnetic region formed in a projection portion of a projection/recess pattern over a substrate and a filler region embedded in a recess portion of the projection/recess pattern, and an organic compound, which exhibits corrosion inhibition action for cobalt or cobalt alloys, between the magnetic region and the filler region.