Patents by Inventor Haruo Funakoshi

Haruo Funakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6587801
    Abstract: Disclosed is an abnormality-cause identifying apparatus including: a retrieving unit for retrieving quality data conforming to retrieving conditions; and a computing unit for computing mean values and standard deviations of the retrieved quality data, the computing unit further computing the likelihood of abnormality of each of manufacturing apparatuses, on the basis of the mean values and the standard deviations.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: July 1, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Haruo Funakoshi
  • Publication number: 20020022937
    Abstract: Disclosed is an abnormality-cause identifying apparatus including: a retrieving unit for retrieving quality data conforming to retrieving conditions; and a computing unit for computing mean values and standard deviations of the retrieved quality data, the computing unit further computing the likelihood of abnormality of each of manufacturing apparatuses, on the basis of the mean values and the standard deviations.
    Type: Application
    Filed: January 16, 2001
    Publication date: February 21, 2002
    Inventor: Haruo Funakoshi
  • Patent number: 4954772
    Abstract: In a test method of an electrostatic breakdown of a semiconductor device in accordance with the present invention, a plurality of semiconductor devices are disposed at random on a member which has been electrostatically charged with a predetermined voltage, and the semiconductor devices are caused to be discharged while being moved on the member. Then, a test is performed to determine whether an electrostatic breakdown occurs in each of semiconductor devices. The electrical characteristics of each semiconductor device are measured after the charged static electricity has been removed. Each semiconductor device to be tested is incorporated in a package and has lead terminals connected to a semiconductor chip.
    Type: Grant
    Filed: March 14, 1988
    Date of Patent: September 4, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Haruo Funakoshi